Diffusion and Stresses

Erscheinungsjahr 1996
ISBN: 978-3-03859-979-1
Verlag: Trans Tech Publications

Sonstiges, Englisch, 356 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

The problem of the interrelationship between diffusion and stresses is as old as the investigation of diffusion itself. Crack formation during surface oxidation, stress-induced diffusion (creep, Gorsky-effect) and the macroscopic deformation of diffusion couples during interdiffusion are well-known classical examples.

Autoren/Hrsg.

Beke, D.L.

Szab?, I.A.

Inhaltsverzeichnis

Diffusion and StressesWhy Diffusion and Stresses?Diffusion and Stresses: Basic ThermodynamicsCoherent Phase EquilibriaThe Effect of Pressure on DiffusionEffect of Elastic Stress Field on Diffusion Fluxes and Growth Rate of a PrecipitateStress-Sensitive Effects in Diffusion ZoneReactive Diffusion and StressesNon-Local Effects of StressStresses during Silicide Formation: A ReviewStresses Effect on Grain Boundary Diffusion in Thin FilmsStress Effects on Interdiffusion in Amorphous MultilayersMechanical Stresses due to Co Precipitation in Granular AgCo FilmsReaction Rates and Stresses during Solid State Amorphization in Nickel-Hafnium Diffusion CouplesDiffusion Phenomena of Solid Phase Reactions in Thin Films Prepared by High Temperature Successive DepositionActivation Volume for the Oxidation in Finely Divided Vanadium FerritesInternal Stress Evolution in Multicomponent Thin Metal Films under Electric CurrentElectromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small DimensionsDiffusion Induced Stresses as a Driving Force for the Instability of a Solid/Liquid InterfaceInfluence of Mechanical Pressure on Ionic Charge Transport Across the Ag Agl-Interface - Periodic Oscillations of Interfacial PropertiesPeriodic Layer Formation during Solid State ReactionsEvidence for Pressure Effect on Impurity Segregation in Grain Boundaries and Interstitial Grain Boundary Diffusion MechanismNon-Stationary Diffusional Creep in Dispersion Strengthened TungstenStress and Diffusion in a One-Component Viscous ContinuumDiffusion-Enhanced Deformation of a Circular InclusionCuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical StressInterdiffusion and Stress, Free Boundary Problem for r - Component (r > 2) One Dimensional Mixture Showing Constant ConcentrationStationary Strain Field in Nonhomogeneous Solid Mixed Boundary Value Problem of the Navier EquationInterdiffusion and Diffusional Structures in Multicomponent Alloys; The Mathematical Model for Thin FilmsStrain-Gradient Influence on Hydrogen Diffusion Coefficients in Pd81Pt19 SystemPenetration Depth of Nickel Hydride into Nickel at Different Activities of Gaseous HydrogenStresses and Two/Phase Zone Formation during Interdiffusion in Ternary SystemsEffect of Stresses on the Nucleation of Intermediate Phases in the Process of Reactive DiffusionMicromechanical Approach of the High Temperature Oxidation of ZirconiumThe Effect of Stress on the Evolution of Macrostep Morphology during Surface InterdiffusionThe Effect of Low Pressure on Stress Relaxation and Intermetallic Growth KineticsActivation Volumes for the Oxidation of Finely Divided Vanadium FerritesInfluence of Coherency Stress on Kinetic DemixingInterdiffusion in Binary Systems during Rapid Heating: Thermoelastic Stress InfluenceGorsky-Diffusion-Elastic''Uphill'' Effects of Hydrogen Interstitial Strain Gradients in Palladium and Palladium AlloysResidual Stresses and Reactivity of Solids. Determination and Part Plaid in the Reaction MechanismsSteady State Grain Boundary Migration during Bulk Diffusion: Effect of Elastic AnisotropyWedge-Like Phase Growth along Grain BoundariesDiffusion and Absorption of Point Defects as a Source of Internal Stress in Polycrystals under IrradiationAnelastic and Plastic Deformation Components of AIMgZn Type AlloysStress Induced Diffusion in Incandescent Lamp Filament