Advances in Heat Transfer

Erscheinungsjahr 2024
ISBN: 978-0-443-29538-6
Verlag: Elsevier Science & Technology

Buch, Englisch, Format (B × H): 152 mm x 229 mm, Gewicht: 450 g

Advances in Heat Transfer, Volume 58 presents the latest in a serial that highlights new advances in the field, with this updated volume presenting interesting chapters written by an international board of authors. Sample chapters in this new release include Nanoscale Thin Film Evaporation and Ice thermal energy storage modeling: A review.

Autoren/Hrsg.

Weitere Mitwirkende

Abraham, John Patrick

Gorman, John M.

Minkowycz, Wolodymyr J.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Mechanische und Thermische Verfahrenstechnik
• Technische Wissenschaften Energietechnik | Elektrotechnik Thermische Energieerzeugung, Wärmeübertragung

Inhaltsverzeichnis

1. Nanoscale Thin Film Evaporation
Beskok Ali, Vladimir Ajaev, Mustafa Ozsipahi and Adam Wilson
2. Title yet to be decided
Mostghimi Javad
3. Title yet to be decided
Abdulmajeed Mohamad
4. Title yet to be decided
Kambiz Vafai
5. Title yet to be decided
Vajravelu Kuppalapalle
6. Title yet to decide
Tie Wei and Yanxing Wang
7. Ice thermal energy storage modeling: A review
Sandra Boetcher, Nuha Aljuneidi, Rafael Rodriguez and Karl Heine

Über Autor(innen)

Abraham, John Patrick
John Abraham is at University of St. Thomas, Saint Paul, MN, USA

Gorman, John M.
John Gorman is at University of Minnesota, Minneapolis, MN, USA

Minkowycz, Wolodymyr J.
Wolodymyr J. Minkowycz is the James P. Hartnett professor of mechanical engineering at the University of Illinois at Chicago. He has performed seminal research in several branches of heat transfer and has published about 175 papers in archival journals. He is also editor-in-chief of the International Journal of Heat and Mass Transfer and the founding editor of Numerical Heat Transfer.