Bazu / Bajenescu Failure Analysis

A Practical Guide for Manufacturers of Electronic Components and Systems
1. Auflage 2011
ISBN: 978-1-119-99000-0
Verlag: John Wiley & Sons
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 344 Seiten, E-Book

Failure analysis is the preferred method to investigate product orprocess reliability and to ensure optimum performance of electricalcomponents and systems. The physics-of-failure approach is the onlyinternationally accepted solution for continuously improving thereliability of materials, devices and processes. The models havebeen developed from the physical and chemical phenomena that areresponsible for degradation or failure of electronic components andmaterials and now replace popular distribution models for failuremechanisms such as Weibull or lognormal.
Reliability engineers need practical orientation around thecomplex procedures involved in failure analysis. This guide acts asa tool for all advanced techniques, their benefits and vitalaspects of their use in a reliability programme. Using twelvecomplex case studies, the authors explain why failure analysisshould be used with electronic components, when implementation isappropriate and methods for its successful use.
Inside you will find detailed coverage on:
* a synergistic approach to failure modes and mechanisms, alongwith reliability physics and the failure analysis of materials,emphasizing the vital importance of cooperation between a productdevelopment team involved
* the reasons why failure analysis is an important tool forimproving yield and reliability by corrective actions
* the design stage, highlighting the 'concurrentengineering' approach and DfR (Design for Reliability)
* failure analysis during fabrication, covering reliabilitymonitoring, process monitors and package reliability
* reliability resting after fabrication, including reliabilityassessment at this stage and corrective actions
* a large variety of methods, such as electrical methods, thermalmethods, optical methods, electron microscopy, mechanical methods,X-Ray methods, spectroscopic, acoustical, and laser methods
* new challenges in reliability testing, such as its use inmicrosystems and nanostructures
This practical yet comprehensive reference is useful formanufacturers and engineers involved in the design, fabrication andtesting of electronic components, devices, ICs and electronicsystems, as well as for users of components in complex systemswanting to discover the roots of the reliability flaws for theirproducts.

Autoren/Hrsg.

Bazu, Marius

Bajenescu, Titu

Inhaltsverzeichnis

Series Editor's Foreword.
Foreword by Dr. Craig Hillman.
Series Editor's Preface.
Preface.
About the Authors.
1 Introduction.
1.1. The Three Goals of the Book.
1.2. Historical Perspective
1.3. Terminology.
1.4. State of the Art and Future Trends.
1.5. General Plan of the Book.
References.
2 Failure Analysis - Why?
2.1. Eight Possible Applications.
2.2. Forensic Engineering.
2.3. Reliability Modeling.
2.4. Reverse Engineering.
2.5. Controlling Critical Input Variables.
2.6. Design for Reliability.
2.7. Process Improvement.
2.8. Saving Money by Early Control.
2.9. A Synergetic Approach.
References.
3 Failure Analysis - When?
3.1. During Development Cycle.
3.2. Preparing the Fabrication.
3.3. FA during Fabrication.
3.4. FA after Fabrication.
3.5. FA during Operation or Storage.
References.
4 Failure Analysis - How?
4.1. Procedures for failure analysis.
4.2. Techniques for decapsulating the device and for samplepreparation.
4.3. Techniques for failure analysis.
References.
5. Failure Analysis - What?
5.1 Failure Modes and Mechanisms at Various Process Steps.
5.2 Failure Modes and Mechanisms of Passive ElectronicParts.
5.3 Failure Modes and Mechanisms of Silicon BipolarTechnology.
5.4 Failure Modes and Mechanisms of MOS Technology.
5.5 Failure Modes and Mechanisms of Optoelectronic and PhotonicTechnologies.
5.6 Failure Modes and Mechanisms of Non-SiliconTechnologies.
5.7 Failure Modes and Mechanisms of Hybrid Technology.
5.8 Failure Modes and Mechanisms of MicrosystemTechnologies.
References.
6 Case Studies.
6.1 Case Study No. 1: Capacitors.
6.2 Case Study No. 2: Bipolar Power Devices.
6.3 Case Study No. 3: CMOS Devices.
6.4 Case Study No. 4: MOS Field Effect Transistors.
6.5 Case Study No. 5: Thin Film Transistors.
6.6 Case Study No. 6: High Electron Mobility Transistors.
6.7 Case Study No. 7: MEMS Resonators.
6.8 Case Study No. 8: MEMS Micro-Cantilevers.
6.9 Case Study No. 9: MEMS Switches.
6.10 Case Study No. 10: Magnetic MEMS Switches.
6.11 Case Study No. 11: Chip-Scale Packages.
6.12 Case Study No. 12: Solder Joints.
6.13 Conclusions.
References.
7. Conclusions.
References.
Acronyms.
Glossary.
Index.