Buch, Englisch, 638 Seiten, Format (B × H): 183 mm x 260 mm, Gewicht: 1377 g
Reihe: Electronics Handbook Series
Buch, Englisch, 638 Seiten, Format (B × H): 183 mm x 260 mm, Gewicht: 1377 g
Reihe: Electronics Handbook Series
ISBN: 978-0-8493-8591-9
Verlag: CRC Press
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.
The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.
Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.
Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Fundamentals of the Design Process. Surface Mount Technology. Integrated Circuit Packages. Direct Chip Attach. Circuit Boards. EMC and PCB Design. Hybrid Assemblies. Interconnects. Design for Test. Adhesive and Its Application. Thermal Management. Testing. Inspection. Package/Enclosure. Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach. Product Safety and Third-Party Certification. Appendix A: Definitions. Index.
