Substrate Integrated Antennas and Arrays

1. Auflage 2015
ISBN: 978-1-4987-1453-2
Verlag: CRC Press

Buch, Englisch, 264 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 564 g

Substrate Integrated Antennas and Arrays provides a single source for cutting-edge information on substrate integrated circuits (SICs), substrate integrated waveguide (SIW) feeding networks, SIW slot array antennas, SIC traveling-wave antennas, SIW feeding antennas, SIW monopulse antennas, and SIW multibeam antennas. Inspired by the author’s extensive research, this comprehensive book:

- Describes a revolutionary SIC-based antenna technique with the potential to replace existing antenna technologies

- Examines theoretical and experimental results connected to electrical and mechanical performance

- Explains how to overcome difficulties in meeting bandwidth, gain, and efficiency specifications

Substrate Integrated Antennas and Arrays offers valuable insight into the state of the art of SIC and SIW antenna technologies, presenting research useful to the development of wireless communication base station antennas, portable microwave point-to-point systems, collision avoidance radars, conformal antennas, and satellite antennas.

Autoren/Hrsg.

Cheng, Yu Jian

Fachgebiete

• Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Drahtlostechnologie
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikrowellentechnik

Inhaltsverzeichnis

Substrate Integrated Circuits. Substrate Integrated Feeding Network. Substrate Integrated Slot Array Antennas. Substrate Integrated Traveling-Wave Antennas. Substrate Integrated Feeding Antennas. Substrate Integrated Monopulse Antennas. Substrate Integrated Multibeam Antennas. References.

Über Autor(innen)

Yu Jian Cheng earned his B.Sc from the University of Electronic Science and Technology of China (UESTC), Chengdu, and his Ph.D from Southeast University, Nanjing, China. He is currently a professor at UESTC. Previously, he was part of the research staff at the National University of Singapore. An IEEE and Chinese Institute of Electronics senior member, Dr. Cheng has authored or coauthored more than 70 journal and conference papers, served on the editorial or review boards of various technical journals, and received awards of the One Hundred Person Project of UESTC in 2014, New Century Excellent Talents in University in 2013, National Excellent Doctorate Dissertation of China in 2012, and Jiangsu Province Excellent Doctorate Dissertation in 2011.