Buch, Englisch, 328 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 550 g
Buch, Englisch, 328 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 550 g
ISBN: 978-1-4377-7859-5
Verlag: William Andrew Publishing
Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.
Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.
Zielgruppe
<p>Cluster E-brochure, trade shows and conferences, online display ads, 2x-Email blast to in-house subs </p>
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau Mechatronik, Mikrosysteme (MEMS), Nanosysteme
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
Weitere Infos & Material
Chapter 1: Introduction
Chapter 2: Device fabrication with a silicon crystal substrate
Chapter 3: Ultra-precision technology - taking silicon single crystal as an example
Chapter 4: Applications of ultra-precision CMP in device processes
Chapter 5: The future of processing technology
Chapter 6: Progress of the semiconductor and silicon industries
Chapter 7: Summary