Buch, Englisch, Band 24, 334 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 534 g
Buch, Englisch, Band 24, 334 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 534 g
Reihe: Springer Series in Advanced Microelectronics
ISBN: 978-90-481-7151-4
Verlag: Springer Netherlands
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Technik Allgemein Nanotechnologie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau Mechatronik, Mikrosysteme (MEMS), Nanosysteme
- Technische Wissenschaften Technik Allgemein Physik, Chemie für Ingenieure
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Naturwissenschaften Physik Mechanik Klassische Mechanik, Newtonsche Mechanik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffprüfung
Weitere Infos & Material
Some Remarks on Microsystem Systematics and Development.- Deep, Three-Dimensional Silicon Micromachining.- Bonding.- Classification of Bonding and Closing Remarks.
