Mechanics of Solder Alloy Interconnects

1994
ISBN: 978-0-442-01505-3
Verlag: Springer US

Buch, Englisch, 418 Seiten, HC runder Rücken kaschiert, Format (B × H): 157 mm x 235 mm, Gewicht: 1780 g

The is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Zielgruppe

Research

Autoren/Hrsg.

Frear, Darrel R.

Lau, John H.

Burchett, Steven N.

Morgan, Harold S.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Werkzeugbau
• Mathematik | Informatik EDV | Informatik Daten / Datenbanken Zeichen- und Zahlendarstellungen

Inhaltsverzeichnis

Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index