THERMES 2007: Thermal Challenges in Next Generation Electronic Systems

Proceedings of THERMES 2007 conference, Santa Fe, New Mexico, January 7-10, 2007
Erscheinungsjahr 2007
ISBN: 978-90-5966-051-9
Verlag: Millpress

Buch, Englisch, 428 Seiten

With each new generation, electronic products have become faster and
have incorporated greater functionality. Coupling this trend with
shrinking device sizes leads to ever-increasing power densities. These
pressures highlight thermal management as a critical consideration at
all levels of the electronic product hierarchy from the chip to the
system.

Considering these critical design issues and the promises of new
technology, it is imperative for the thermal community to focus on these
thermal challenges to ensure the continued growth of the trillion-dollar
electronics industry.

THERMES 2007 provides a unique opportunity for the community to focus on
these challenges with a heavy emphasis placed on the many possible
solutions to these increased demands. This volume collects the many
promising ideas presented and covers a broad range of thermal
management topics from heat pipes and microchannel coolers to nanoscale
thermal transport, spanning harsh environments to microscale domains.

Autoren/Hrsg.

Garimella, S.V.

Fleischer, A.S.

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik