Semiconductor Manufacturing Handbook

Erscheinungsjahr 2005
ISBN: 978-0-07-144559-7
Verlag: McGraw-Hill Education

Buch, Englisch, 800 Seiten, Format (B × H): 196 mm x 241 mm, Gewicht: 1591 g

This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.

Autoren/Hrsg.

Geng, Hwaiyu

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie

Inhaltsverzeichnis

PART 1: Semiconductor Fundamentals and Basic MaterialsBOARD OF REVIEWERSCONTRIBUTORSPREFACEACKNOWLEDGMENTSChapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin ZhouChapter 2: IC Design - Ilsun ParkChapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. RaviChapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik ChandaChapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. TuChapter 6: Plasma Process Control - David J. CoumouChapter 7: Vacuum Technology - Peter BiltoftChapter 8: Photomask - Charles HowardPART 2: Wafer ProcessingChapter 9: Microlithography - Chris A. MackChapter 10: Ion Implantation and Rapid Thermal Processing - Michael GrafChapter 11: Wet Etching - Peng ZhangChapter 12: Plasma Etching - Shouliang LaiChapter 13: Physical Vapor Deposition - Florian SolzbacherChapter 14: Chemical Vapor Deposition - Edward J. McInerneyChapter 15: Epitaxy - Jamal Ramdani, Giovanni VaccariChapter 16: ECD Fundamentals - Tom Ritzdorf, John KlocksChapter 17: Chemical Mechanical Planarization - Timothy S. DyerChapter 18: Wet Cleaning - Andrew MachamerPart 3: Final ManufacturingChapter 19: Inspection, Measurement, and Test - Donald W. BlairChapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki OtaniChapter 21: Packaging - Dietrich Tonnies, Michael TopperPart 4: Nanotechnology, MEMS, and FPDChapter 22: Nanotechnology and Nanomanufacturing - Zhong L. WangChapter 23: Fundamentals of Microelectromechanical Systems - Michael A. HuffChapter 24: Flat-Panel Display Technology and Manufacturing - David N. LiuPart 5: Gases and ChemicalsChapter 25: Specialty Gas and CDA Systems - Wayne D. CurcieChapter 26: Waste Gas Abatement Systems - Joseph D. SweeneyChapter 27: PFC Abatement - James C. CoxChapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan BarsnessChapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. GouldChapter 30: Fundamentals of Ultrapure Water - David J. AlbrechtPart 6: Fab Yield, Operations, and FacilitiesChapter 31: Yield Management - Bo Li, Wayne CarrikerChapter 32: Automated Material Handling System - Clint HarrisChapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina MenakerChapter 34: Six Sigma - Bruno Scibilia, Yoan DupretChapter 35: Advanced Process Control - Robert H. McCaffertyChapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. TrammellChapter 37: Plan, Design, and Construction of a FAB - Industrial Design and ConstructionChapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. BeckChapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal AmickChapter 40: ESD Controls in Cleanroom Environments - Larry LevitChapter 41: Airborne Molecular Contamination - Chris MullerChapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry GromalaChapter 43: Wastewater Neutralization Systems - Richard E. PinkowskiAPPENDIXINDEX

Über Autor(innen)

Geng, Hwaiyu
Hwaiyu Geng (Palo Alto, CA) is Manager of Corporate Project Planning and Management for the Hewlett Packard Corporation. He managed the design and construction HP’s Inkjet manufacturing facility in Shanghai, China.

Hwaiyu Geng, CMfgE, P.E. (Palo Alto, California) is a Project Manager of Corporate REWS at Hewlett-Packard Company. His experience in manufacturing engineering is diverse, including work at Applied Materials and Hewlett-Packard’s high-tech industries. He has faced many of the challenges facing engineers today, having designed manufacturing processes and facilities for new products, implemented automated manufacturing systems, and established quality, safety, and maintenance programs. He is a Certified Manufacturing Engineer by the Society of Manufacturing Engineers and a Professional Engineer in the State of California. Mr. Geng is also the author of McGraw-Hill's Manufacturing Engineering Handbook.