Interfacial Phenomena in Adhesion and Adhesive Bonding

1. Auflage 2024
ISBN: 978-981-99-4455-2
Verlag: Springer Nature Singapore

Buch, Englisch, 360 Seiten, HC runder Rücken kaschiert, Format (B × H): 160 mm x 241 mm, Gewicht: 790 g

This open access book reviews the recent research achievements of the investigation of interfacial phenomena in polymer/polymer and polymer/metal joint interfaces with the state-of-the-art analytical techniques not previously used in the field of adhesion and bonding. Adhesion performance is determined not only by the two-dimensional interfaces but also by a three-dimensional (3D) region having different properties and structural characteristics that extends into the bulk materials. In this book, the authors also discuss in detail the bonding mechanism by characterizing such 3D regions called “interphase”. The book is of great interest to researchers and engineers devoted to adhesion science and technology.

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Zielgruppe

Research

Autoren/Hrsg.

Horiuchi, Shin

Miyamae, Takayuki

Terasaki, Nao

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde
• Naturwissenschaften Chemie Analytische Chemie Magnetresonanz
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Oberflächenbeschichtung

Inhaltsverzeichnis

Introduction – Interfaces in adhesion and adhesive bonding.- 2. Electron microscopy for visualization of interfaces in adhesion and adhesive bonding.- Interfacial phenomena in adhesion and adhesive bonding investigated by electron microscopy.- Direct visualization of mechanical behavior during adhesive bonding failure using mechanoluminescence (ML).- Analysis of molecular surface/interfacial layer by sum-frequency generation (SFG) spectroscopy.

Über Autor(innen)

Dr. Shin Horiuchi is the leader of Adhesion and Interfacial Phenomena (AIRL) at National Institute of Advanced Industrial Science and Technology (AIST) located in Tsukuba, Japan. He graduated from Tokyo Institute of Technology (TIT) in 1985 and received his Ph.D. (1997) in organic and polymer materials from Tokyo Institute of Technology. His research mainly focuses on adhesion and interfacial phenomena using electron microscopy techniques. He has received several awards from the Adhesion Society of Japan, Society of Polymer Science, Japan; and Adhesion Society (US) and the Ministry of Economy, Trade and Industry (METI), Japan. He has published over 100 papers on adhesion, interface, polymer blends, and composite materials in international scientific journals.

Nao Terasaki, Ph.D. is Research Team Leader of 4D visual sensing team (4DVsens) in Sensing System Research Center (SSRC) in National Institute of Advanced Industrial Science and Technology (AIST). He received his Ph.D. from Kyushu University. After joining into AIST in 2003, he has investigated on mechanoluminescent (ML) sensing material and ML visual sensing especially in application. He has developed (1) ubiquitous ML light source, (2) structural health monitoring (SHM) in infrastructure, (3) sophistication of design and simulation on light weight material and structure through ML visualization, (4) ML inspection of weak-bond area and (5) international standardization from the viewpoint of visualization of dynamic strain distribution. 

Prof. Takayuki Miyamae received his Ph.D. from Nagoya University in 1995. In 1999, he joined the Agency of Industrial Science and Technology, the predecessor of the National Institute of Advanced Industrial Science and Technology (AIST). He joined Chiba University as Professor in July 2020. His research includes organic electronics, liquids, polymers and adhesive interfaces using linear and nonlinear optical spectroscopy. On the areaof organic electronics, he is interested in using doubly resonant sum-frequency generation and electric field-induced technique to probe charge carrier behavior in organic devices. On the area of physical chemistry, he studies by sum-frequency generation spectroscopy to investigate the molecular arrangement in many types of interfaces, including liquids, polymers and buried organic interfaces.