E-Book, Englisch, 82 Seiten
Hu Material Engineering Research II
Erscheinungsjahr 2021
ISBN: 978-3-0357-3712-7
Verlag: Trans Tech Publications
Format: PDF
Kopierschutz: 0 - No protection
E-Book, Englisch, 82 Seiten
ISBN: 978-3-0357-3712-7
Verlag: Trans Tech Publications
Format: PDF
Kopierschutz: 0 - No protection
The 3rd International Conference on Material Engineering Research (3rd ICMER 2020) took place in Incheon National University, Incheon, South Korea, during May 22th-24th, 2020. Papers, collected by the results of this conference, represent to readers the latest research results in the field of applied materials and advanced materials processing technologies.
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Preface
Preparation of Ethanolic Butterfly Pea Extract Using Microwave Assisted Extraction and Loaded Nanostructured Lipid Carriers: Evaluation of Antioxidant Potential for Stabilization of Fish Oil
Preparation Adlay and Black Sesame Seeds Extracts Using Osmotic Dehydration and Increasing the Stability of Extracts Using Encapsulation
Thermal Performance of the Alkali Activated Binder Developed from Rice Husk Ash and Bottom Ash
A Combination of Dracaena fragrans and Trichodermafungus in Removing Heavy Metals Contamination from Agricultural Soils
Innovative UHS Steel Material for Tension-Only Braced CFS Walls
Influence of the P-Delta Effect on the Design of Steel Moment Resisting Frame in Seismic Areas
Study on Effect of Different Compaction Methods of Aeolian Sand in Taklimakan Desert by Content of Powder Clay
Fatigue Damage Monitoring of CFRP Elements by Thermographic Procedure under Bending Loads
Control the Surface Wettability of Thermo-Responsive Poly(Ethylene Glycol Methyl Ether methacrylate-co-Triethylene Glycol Methyl Ether Methacrylate) Thin Film by Varying Temperature
The Swelling and Transition Behavior of Thermo-Responsive Poly(2-(2-Methoxyethoxy) Ethoxyethyl Methacrylate-co-Poly(Ethylene Glycol) Methyl Ether Methacrylate) Thin Films
Amplification Factor for Wood-Concrete Hybrid Structures Based on Dynamic Numerical Simulation