Copper Electrodeposition for Nanofabrication of Electronics Devices

2014
ISBN: 978-1-4614-9175-0
Verlag: Springer

Buch, Englisch, 282 Seiten, HC runder Rücken kaschiert, Format (B × H): 160 mm x 241 mm, Gewicht: 606 g

Reihe: Nanostructure Science and Technology

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Kondo, Kazuo

Yokoi, Masayuki

Akolkar, Rohan N.

Barkey, Dale P.

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Oberflächenbeschichtung
• Naturwissenschaften Chemie Physikalische Chemie Elektrochemie, Magnetochemie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Metallische Werkstoffe
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Metallurgie
• Technische Wissenschaften Technik Allgemein Nanotechnologie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Biomaterialien, Nanomaterialien, Kohlenstoff

Inhaltsverzeichnis

Copper Electrodeposition.- Suppression Effect and Additive Chemistry.- Acceleration Effect.- Modeling and Simulation.- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects.- Microstructure of Evolution of Copper in Nano-scale Interconnect Features.- Direct Copper Plating.- Through Silicon Via.- Build-up Printed Wiring Boards.- Copper Foil Smooth on Both Sides for Lithium Ion Battery.- Through Hole Plating.

Über Autor(innen)

Kazuo Kondo is Professor at the Department of Chemical engineering, Osaka Prefecture University. He has over 200 research publications and 100 patents. His major areas of research are copper electrodeposition for nano fabrication, electrodeposition, batteries, and CVD.

Dale Barkey is a Professor of Chemical Engineering at the University of New Hampshire where he joined the faculty in 1987. His research in Electrochemical Engineering has addressed Pattern Formation, Electrodeposition, Anodizing and Corrosion Processes. His work has appeared in The Journal of the Electrochemical Society, Physical Review, The American Concrete Institute Materials Journal and Plating and Surface Finishing.

Rohan Akolkar is an Associate Professor of Chemical Engineering at Case Western Reserve University (CWRU) in Cleveland, OH. His research focuses on fundamental electrochemistry and electrochemical engineering. His work on electrodeposition has appeared in the Journal of the Electrochemical Society and the Journal of Power Sources. In 2004, he was received the Norman Hackerman Prize by the Electrochemical Society.

Masayuki Yokoi is the Chief Technical Consultant at the Industrial Technology Support Institute of Higashioska City, Osaka Prefecture, Japan.