Electronic Materials

Erscheinungsjahr 2010
ISBN: 978-0-87849-154-4
Verlag: Trans Tech Publications

Buch, Englisch, 486 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 1100 g

Volume is indexed by Thomson Reuters BCI (WoS).The electronic properties of solids have become of increasing importance in the age of information technology. The study of solids and materials, while having originated from the disciplines of physics and chemistry, has evolved independently over the past few decades. The classical treatment of solid-state physics, which emphasized classifications, theories and fundamental physical principles, is no longer able to bridge the gap between materials advances and applications. In particular, the more recent developments in device physics and technology have not necessarily been driven by new concepts in physics or new materials, but rather by the ability of engineers to control crystal structures and properties better via advances in crystal growth and patterning techniques. In many cases, new applications simply arise from the adaption of conventional ideas to interdisciplinary areas. One example is that of recent advances which rely heavily upon the availability of the sub-micron technology developed by the semiconductor industry. Another example is the emergence of nanotechnology.

Autoren/Hrsg.

Kwok, H.L.

Fachgebiete

• Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Kontinuumsmechanik

Inhaltsverzeichnis

Preamble
Table of Contents
Chapter I. THE BASIC STRUCTURES OF SOLIDS
I-1. Introduction. I-2. Atoms and Binding Forces
I-3. Crystal Structures
I-4. Crystalline Solids
I-5. Polycrystalline and Non-Crystalline Solids
I-6. The Phase Diagrams
I-7. Techniques on Crystal Growth and Thin Film Deposition
I-8. Crystal Imperfection
I-9. Diffusion in Solids
I-10. Physical Diagnostic Tools
Glossary
References
Exercises for Chapter I
Chapter II. ELECTRICAL PROPERTIES OF SOLIDS
II-1. Introduction. II-2. Electrons in a Solid
II-3. Energy Distribution of the Electrons
II-4. The Energy Band Diagram
II-5. Mathematical Formulation of the Conduction Processes
II-6. Conductors
II-7. Semiconductors
II-8. Other Conduction Mechanisms
II-9. Velocity Saturation and Negative-Resistance Effect
II-10. Insulators
Glossary for End-of-Chapter Review
References
Exercises for Chapter II
Chapter III. P-N JUNCTIONS AND RELATED DEVICES
III-1. Introduction. III-2. Concept of a P-N Junction
III-3. Schottky Junction and its Electronic Properties
III-4. Metal-Semiconductor Contact
III-5. MIS Junction and Field-Effect Properties
III-6. Materials Considerations
III-7. Structures and Operation of Transistors
III-8. Non-Ideal Effects and other Performance Parameters
III-9. New Transistors
Glossary for End-of-Chapter Review
References
Exercises for Chapter III
Chapter IV. OPTICAL PROPERTIES OF SOLIDS
IV-1. Introduction. IV-2. Review of the Properties of Light
IV-3. The Absorption Process
IV-4. The Emission Process
IV-5. Imagers
IV-6. Displays
IV-7. Power Generation
IV-8. Optical Signal Transmission Media
Glossary
References
Exercises for Chapter IV
Chapter V. MAGNETIC AND SUPERCONDUCTING PROPERTIES OF SOLIDS
V-1. Introduction
V-2. Magnetic Properties of Solids
V-3. Sources of Magnetization
V-4. Magnetic Anisotropy and Invar Alloys
V-5. Amorphous Magnetic Materials
V-6. Soft Magnets and Hard Magnets
V-7. Magnetic Devices and Applications
V-8. Properties of Superconductors
V-9. Applications of Superconductors
V-10. Superconducting Materials
Glossary for End-of-Chapter Review
References
Exercises for Chapter V
Chapter VI. MICROMACHINES, SENSORS AND PACKAGING MATERIALS
VI-1. Introduction. VI-2. Micromachining
VI-3. Polysilicon Films Used in Micro-Structures
VI-4. Applications of Micro-Structures
VI-5. Heat and Temperature Sensors
VI-6. Displacement and Flow Sensors
VI-7. Chemical Sensors
VI-8. Optical Sensors
VI-9. Design of a Pressure Transducer
VI-10. Grounding, Shielding and Interference
VI-11. Packaging Materials
Glossary for End-of-Chapter Review
References
Exercises for Chapter VI
Appendix