Liao / Chen / Chao | Advances in Abrasive Technology XIII | Sonstiges | 978-3-908452-44-7 | sack.de

Sonstiges, Englisch, 1050 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

Liao / Chen / Chao

Advances in Abrasive Technology XIII

Sonstiges, Englisch, 1050 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

ISBN: 978-3-908452-44-7
Verlag: Trans Tech Publications


Volume is indexed by Thomson Reuters CPCI-S (WoS).
Abrasive machining is one of the oldest technologies, and continues to have a far-reaching impact on a broad spectrum of industries. In particular, there is an ever-increasing demand by modern manufacturing for advanced abrasive techniques and other precision machining technologies. As well as abrasive-related technologies, electrical discharge machining (EDM), glass molding, machine tool systems, green manufacturing, laser-beam machining, tribology, advanced cutting methods, etc. are addressed here. The more than 167 presentations contributed by workers from all over the world will make this volume essential reading.
Liao / Chen / Chao Advances in Abrasive Technology XIII jetzt bestellen!

Weitere Infos & Material


Progress in the Modeling of Abrasive Jet MachiningCharacteristics and Polishing Effect of Abrasive Jet Beam with Polymer Abrasive Suspension AdditivesMechanical Characterization of Lapping Plate Materials in Diamond Charging Process Simulation of Grinding Surface Creation ? A Single Grit ApproachA Study on Multi-Objective Optimization of Abrasive Blasting SystemsAnalysis and Modeling of Micro Abrasive Air Jet Cutting Aspect RatioContact Conditions in 5-Axis-Grinding of Double Curved Surfaces with Toric Grinding WheelsAnalysis of Super-High Speed Point Grinding ForcesTheoretical Analysis of Grinding Temperature Field for Carbon Fiber Reinforced PlasticsLaser Assist Powder Jet DepositionA Study on Pressure Stability in Double-Sided Polishing ProcessProcess Influences in the Wire Cutting of ConcreteResearch on Machining Simulation of Ultra High-Speed Grinding Machine Tool Based on WebWear of Polishing Pad and Pattern Optimization of Fixed Abrasive PadGrinding Characteristic Research of High Efficiency Deep Grinding for Viscous MaterialA Simulation System for Grinding Based on Virtual RealityAnalysis of Roughness in Super-High Speed Point GrindingGrinding Performance of a Grain-Arranged Diamond Wheel against Aluminum Alloys and Ti6Al4VStudy on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond WheelInvestigation of Grinding Process SimulationFabrication of a Spherical Silicon Solar Cell ModuleApplication of a Case-Based Process Expert System for NC Camshaft GrindingEffect of Flexing on Coated Abrasive Belt Grinding of Stainless SteelUltrasonic Vibration Grinding Test of Composite Ceramics Based on the Nonlocal TheoryStudy on Surface Residual Stress of Nano-Zirconia Toughened Alumina Ceramics under Two-Dimentional Ultrasonic Vibration Assisted GrindingDevelopment of Media for Low Pressure Abrasive Flow MachiningExperimental Investigation on High-Speed Grinding of 40Cr Steel with Vitrified CBN Grinding WheelOn-Machine Method to Condition the Grinding Ability of Resin-Bond WheelsA Study on the Spiral Polishing of the Inner Wall of Stainless BoresModeling Surface Roughness and Hardness of Grinding SKD11 Steel Using Adaptive Network Based Fuzzy InferenceSurface Texture Analysis of Fixed and Free Abrasive Machining of Silicon Substrates for Solar CellsInfluences of Characteristics of Large Particle on the ?Trap? Effect of Semi-Fixed Abrasive ToolLaboratory Comparison of Mini-Discs with Point-Attack Picks Tool Wear Mechanism in Continuous Cutting of Difficult-to-Cut Material under Dry MachiningOn Geometrical Errors and their Suppression in Turning Operation by Controlling Thrust ForcesOptimal Improvement on Cutting Yield Rate in ACF Attach Process of TFT-LCD Module Using Response Surface MethodStudy on Tool Life by Breakage in Micro EndmillingComparative Studies on the Cutting Performance of HFCVD Diamond and DLC Coated WC-Co Milling Tools in Dry Machining Al/SiC-MMCStudy on the Cutting Performance of HFCVD Diamond Coated Silicon Nitride Inserts in Dry Turning Aluminum Silicon AlloyElastic and Plastic Behaviors in Ductile-Regime Machining Process of Quartz GlassDEM Simulation and Experimental Investigation of Silicon Carbide on Pre-Stressed MachiningA Study on the Ductile Mode Cutting of Lithium NiobateA Study of Ultrasonically Assisted Fly Cutting for High Precision Machining Hard Brittle MaterialsThe Investigation on Small Hole Drilling-Grinding in Glass and CeramicMachining Schemes for Dicing Soda Lime GlassEffect of Shear and Thermal Characteristics on Chemical Mechanical PolishingA Dishing Model for Chemical Mechanical Polishing of Plug StructuresTwo Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si WaferMachining Force and Modes for Si Wafer Machining with Rotational ToolWafer Polishing Process with Signal Analysis and Monitoring for Optimum Condition of MachiningEffects of Wafer Carrier Design on Contact Stress Uniformity in CMPStudy on Chemical Mechanical Polishing with Ultrasonic VibrationExperimental Investigation on Effects of Passivants in the Abrasive-Free Polishing of Copper FilmFriction Phenomenon in Chemical Mechanical Polishing of Oxide FilmDiamond Pad Conditioners with Oriented Polycrystalline Diamond CubesMosaic Diamond Disks with Brazed Pallets for CMPEstimation of Heat Transfer Coefficients in Dry and Cold-Air CuttingTool Life and Surface Roughness of FCD 700 Ductile Cast Iron when Dry Turning Using Carbide ToolEffects of Cutting Fluid with Nano Particles on the Grinding of Titanium AlloysDevelopment of Three-Dimensional Dynamometer for Wafer GrinderElliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire ? Surface Formation CharacteristicsFabrication of Micro Shapes by EDM with Micro Electrodes Generated in Turning OperationStudy on Application of Taguchi Method to Ultrasonic-Aided Spin Welding of Heterogeneous Plastic MaterialsBending of Pure Titanium Sheet to Curved Surface Shape by Laser Forming TechniqueMicrofabrication of Photosensitive Glass by Femtosecond Laser Direct WritingRepairing Damage on Ground Fused Silica by CO2 Laser IrradiationAn Investigation of Attachment on Electrode Surface in Dry EDMInvestigation of Eco-Friendly Fixed-Abrasive Polishing with Compact RobotHigh-Integrity Finishing of 4H-SiC (0001) by Plasma-Assisted PolishingA Review on the CMP of SiC and Sapphire WafersPolyline Dwell Time Algorithm for Every Type of Tool Path for Ultrasonic-Magnetorheological Combined FinishingOdor Suppression of Putrid Water-Soluble Coolant Using Home Ion GeneratorStudy the Rheological Properties of Abrasive Gel with Various Passageways in Abrasive Flow MachiningProcessing Characteristics of Structured Lapping Films under Grinding Load ControlDesign of Product Surface Finish via Magnetic-AssistanceLapping of Polycrystalline Diamond Compact (PDC)Research on the With-In Wafer Non-Uniformity (WIWNU) of the Large Quadrate Optic in the Fast Polishing ProcessFabrication of Small Polishing Tool by Using Electrophoresis PhenomenonIdentification of Brittle-Ductile Material Removal Characteristics in Ultrasonic Aided Lapping of Engineering CeramicsEvaluation of Polished Surface for Viscoelastic PolymerResearch on Axisymmetric Free-Form Creation with Rotating Polishing ToolSimulation Study of Sliding Control for Constant Polishing Force Using an Innovative Sphere-Like Polishing Tool on a Machining CenterChemical Effect on the Material Removal Rate in the CMP of Silicon WafersOn the Technologies of Electrochemical Mechanical FinishingEDM Properties of EC-PCD Using a Copper ElectrodeUsing Electro-Rheological Chain Structure to Improve SKD11 SurfaceGear Finishing and Modification Compound Process by Pulse Electrochemical Finishing with a Moving CathodeA New Polishing Pad of EVA-Adhesive-Dressed-with-SiC-Grits Polishing Face and its Applications in Silicon Wafer PolishingMathematical Modeling of Electrochemical DeburringStudy on Precision Polishing of a Mini Roller MoldAbrasive Wear Caused by EMC ParticlesNumerical Simulation on Two-Step Isothermal Glass Lens MoldingElliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire ? Wear Behaviors of Resin Bond Diamond WheelEffect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface GrindingA Study of the Diamond Tools for Grinding Polycrystalline DiamondComplex Grinding Assisted with Electrical Discharge Machining for Electrically Conductive PCDLoading in Grinding: Chemical Reactions in Steels and Stainless SteelsThe Application of Three-Dimensional Surface Parameters to Characterizing Grinding Wheel TopographyEffect of Ground Surface Roughness of Tool on Adhesion Characteristics of PVD CoatingIntermittent Grinding of Advanced Ceramic with the T-Tool Grinding WheelCharacterization and Performance of Monolayer Brazed Polycrystalline CBN Abrasive ToolsThrust Force Directional Vibration-Assisted Ductile-Mode Grinding of Single-Crystal SiSharpening Mechanism Using Composite Electro-Plating In-Process Sharpening TechniqueInvestigation on Material Property of Electrically Conductive Polycrystalline Composite Diamond (EC-PCD)Processing EC-PCD by Constant-Force Grinding Assisted with EDMUltra High Speed Turning of Inconel 718 with Sialon Ceramic ToolsAnalysis of Surface Topography Characteristics in Electrochemical Mechanical FinishingEffects of Cutting Parameters on the Transverse Vibration of Diamond Circular Saw BladeModeling and Simulation of 3D Surface Finish of GrindingCondition Monitoring in a Machine Tool Spindle Using Wireless SensorApproaches to In-Process Measurement of Surface Roughness in Cylindrical GrindingThe Three-Dimensional Surface Topographic Characterisation of Diamond Grinding WheelsOnline Measurement of the Crankshaft Crankpin Roundness Errors in the Process of Coordinate Polishing with Abrasive TapImprovement in Oxide-Pattern Sizes Controllability on Scanning Probe NanolithographyA Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon WafersThe Development of the Automatic Measurement of Straightness Using by a Ball Screw Study of AE Signal for Tool Wear Monitoring in Micro Milling Based on LVQ AlgorithmNew Development of Contact Probe and MethodologyDesign of Digital Filters for Si Wafer Surface Profile Measurement ? Noise Reduction by Lifting Scheme Wavelet TransformOnline Cutting Tool Wear Monitoring Using I-Kaz Method and New Regression ModelOn-Line Inspection of the Surface Roughness of Workpiece in Ultraprecision MachiningWear Performance Evaluation of Tungsten Carbide Taps in Blind Hole Tapping Cast IronA Study of the Cutting Temperatures of Turning Stainless Steels with Chamfered Main Cutting Edge Nose Radius Worn ToolsDevelopment and Analysis of Special-Shaped Stone Multi-Function NC Machining CenterExperimental Study on Milling Hardened SKD Steel Using Micro CBN Ball-End MillsDrilling Force and Temperature of Bone by Surgical DrillA Ball-Bar Based Error Measurement Method for a RRTTT-Type Five-Axis Machine ToolResearch on a Helical Drill Point Grinding MachineThe Kinematical Performance Analysis of a Kind of Parallel Turning-Grinding MachineDevelopment of a Reverse Micro EDM-Drilling for Holing Diamond-ToolStudy on Thermal Properties of Hybrid Journal Bearing for Super High Speed Grinding MachineGrinding and Polishing of Nanolayered Structures: Thin Film Amorphous Silicon Solar PanelsCIMDW ? A New Technique of Corona Ignited Micro-Discharge in MicroweldingModeling Aspect Ratio of a Micro EDM HoleEffect of Material Type and Tip Radius of AFM Probes on Nanosheets Groove Machining AccuracyMold Fabricated by Nanoscratching for Nanoimprint LithographyThe Determination of Key Material Property in High Energy Beam DrillingGrindability of Micro Pyramid-Structured Surface for Various Hard and Brittle MaterialsEvaluating the Micromachining Rate of Nanosecond Laser with Thermal AnalysisOptimal Parameter Design in Flip Chip Micro-Machining Process for Solder Residue by Using Design of Experiments ApproachInfluence of the Electrochemical Dissolution Effect on the Material Removal Rate Utilizing Electrokinetic PhenomenonA Study of Uncut Chips Produced by CNT Grinding Wheel
In Situ: A Novel Approach for the Production of Micro HolesAnalysis of Mechanical Property of Crystal CaF2 and Effects of Tool Rake Angle on Ductile Machining ProcessInvestigation of Surface Integrity in Conventional Grinding of Ti-6Al-4VEffect of Aged AlN Reinforced Al-Si Alloys on Dry Sliding Wear BehaviourOptimal Cutting Parameters for Desired Surface Roughness in End Milling Inconel 718Polish Properties of Nano-Cluster Diamonds on Glass SubstratesStudy on the Cutting Force, Temperature and Residual Stress in Milling the New Rotor SteelElectromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)The Research of Modulation Period on Photoelectric Properties of Ti/TiN Multilayer FilmsStudy on Deformation and Damage of Single Crystal MgO by Micro-ScratchMicro Abrasive Jet Machining of Silicon Carbide (SiC) Fiber Reinforced Ceramic Matrix CompositeThermal Transport in the Copper Powders with Nanometer and Micrometer ParticlesA Study of Mechanical Properties of Human Femoral Heads Using NanoindentationWear Rate Predication for Steel Based on Regression AnalysisPlastic Flow and Related Wear Mechanisms of CVD TiC CoatingsExperimental Research on Wear Random ProcessExperimental Study on Friction Characteristics of Hot-Pressing Matrix and Granite under Dry Sliding ConditionsAnalysis of Surface Roughness Transformation of Oxide Scale during Hot Steel ManufacturingDressing of Monolayer Brazed Diamond Wheel for Grinding Li-Ti FerriteGeneration Process of Cutting-Edge Distribution on Grinding Wheel with Single-Point Diamond DressingNozzle-Type ELID Grinding Characteristics of Cemented CarbidesThe CMP by Polishing with GiP Dressed by BODDSurface Roughness and Morphology of Titanium Plate Ground with Fixed and Loose Brown Alumina AbrasivesStudy on Plane Magnetic Abrasive Finishing Process - Experimental and Theoretical Analysis on Polishing Trajectory -Investigation of Semi-Fixed Abrasive Plate Wear Characteristics


Ihre Fragen, Wünsche oder Anmerkungen
Vorname*
Nachname*
Ihre E-Mail-Adresse*
Kundennr.
Ihre Nachricht*
Lediglich mit * gekennzeichnete Felder sind Pflichtfelder.
Wenn Sie die im Kontaktformular eingegebenen Daten durch Klick auf den nachfolgenden Button übersenden, erklären Sie sich damit einverstanden, dass wir Ihr Angaben für die Beantwortung Ihrer Anfrage verwenden. Selbstverständlich werden Ihre Daten vertraulich behandelt und nicht an Dritte weitergegeben. Sie können der Verwendung Ihrer Daten jederzeit widersprechen. Das Datenhandling bei Sack Fachmedien erklären wir Ihnen in unserer Datenschutzerklärung.