Buch, Englisch, Band 500, 257 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 417 g
Reihe: IFIP Advances in Information and Communication Technology
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
1. Auflage 2019
ISBN: 978-3-030-15665-7
Verlag: Springer International Publishing
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
Buch, Englisch, Band 500, 257 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 417 g
Reihe: IFIP Advances in Information and Communication Technology
ISBN: 978-3-030-15665-7
Verlag: Springer International Publishing
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.
The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Zielgruppe
Research
