Manufacturing and Properties of Functional Materials

Erscheinungsjahr 2023
ISBN: 978-3-0364-0326-7
Verlag: Trans Tech Publications

Buch, Englisch, 126 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 360 g

The special edition includes articles that represented the latest research results and engineering solutions in the area of silicon carbide wafer manufacturing for power electronics, functional polymer and composite materials for various applications and special microwave absorption materials for defence from electromagnetic radiation. This special edition will be interesting to semiconductor power device production specialists and many branches of applied materials science.

Autoren/Hrsg.

Marek, Juraj

Pobegen, Gregor

Grossner, Ulrike

Quah, Hock Jin

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde

Inhaltsverzeichnis

Preface
Chapter 1: Silicon Carbide Wafer Manufacturing
Transfer of Heteroepitaxial Grown 3C-SiC Layers for Application in Optical Frequency Combs
Suppression of In-Grown SF Formation and BPD Propagation in 4H-Sic Epitaxial Layer by Sublimating Sub-Surface Damage before the Growth
Ni-Silicide Ohmic Contacts on 4H-SiC Formed by Multi Pulse Excimer Laser Annealing

In Situ Monitoring of the Ambient Gas Phase during PVT Growth of Nominally Undoped High Resistivity SiC Boules
Study of GHz-Burst Femtosecond Laser Micro-Punching of 4H-SiC Wafers
3C-SiC Island Growth on 4H-Sic Terraces: Statistical Evidence for the Orientation Selection Rule
Development of High Quality 8 Inch 4H-SiC Substrates
Tailored Polycrystalline Substrate for SmartSiCTM Substrates Enabling High Performance Power Devices
Study on Estimation of Device Yield in Non-Epitaxial 4H-SiC Material Relating to Defect Densities Influencing Bipolar Degradation with XRT- Measurements
Chapter 2: Functional Materials
PVA Nanofibers Embedded with Different Concentration of ZnO Prepared by Electrospinning Method
Dielectric Properties of Epoxy Composites Containing Silver Nanoparticle and Carbon Nanotube over the X-Band Frequency
Thermomechanical and Dielectric Properties Relationship of Hybrid Carbon Black and Nano Silica Epoxy Composites
Selective Etch for Micromachining Process in Manufacturing Hybrid Microdevices composed of Ni-Mn-Ga and Silicon Layers
Impedance and Dielectric Characterization of Epoxy Composites Containing Carbon Black and Carbon Nanotubes
Chapter 3: Microwave Absorbing Materials
The Optimal Performance of a Geopolymer Hollow Pyramidal Microwave Absorber with Triangular Slotted
The Performance of Hollow Pyramidal Microwave Absorber Using Different Slot Size
Utilization of Carbon Biomass as an Absorbing Material in Anti-Microwave Brick Walls Manufacturing