Marinescu / Uhlmann / Doi Handbook of Lapping and Polishing

Erscheinungsjahr 2006
ISBN: 978-1-4200-1763-2
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 512 Seiten

Reihe: Manufacturing Engineering and Materials Processing

Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.

Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.

Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

Zielgruppe

Manufacturing and mechanical engineers as well as technicians in the automotive, aerospace, electronics, semiconductor manufacturing, and metalworking industries; manufacturers and purchasers of surface finishing equipment; students in mechanical, electrical, electronics, and manufacturing engineering; tribologists.

Autoren/Hrsg.

Marinescu, Ioan D.

Uhlmann, Eckart

Doi, Toshiro

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Metallurgie

Inhaltsverzeichnis

INTRODUCTION; Ioan Marinescu
From Craft to Science
Importance of the Abrasive
Problem Solving
References

FUNDAMENTALS OF LAPPING; Eckart Uhlmann
General Considerations
Historical Development of Lapping
Definition of Lapping and Classification of Lapping Processes
Process Mechanisms and Subsurface Damage in Lapping
Lapping Process as a Removal System
Tool Specification
Machine Settings
Fundamentals of Planetary Kinematics
Process Models and Simulation
Symbols and Abbreviations
References

LAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku
Introduction
Physics of the Process
Mechanism of the Process
References
Bibliography

LAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana Pruteanu
Introduction
Background Information
Nontraditional Lapping Processes
ELID-Lap Grinding
Materials, Experimental Setup, and Testing Procedure (Study Case)
Experimental Results and Discussion
References
Bibliography
Appendix A
Appendix B

LAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa
Introduction
Processing Principles of Lapping and Its Characteristics
Lapping Machine
Both-Sides Simultaneous Lapping Machine Equipped with a New Micromotion Mechanism
Conclusions

POLISHING TECHNOLOGY; Toshiro K. Doi
Polishing Principles
Processing Accuracy and Damaged Layer
Polishing Machines
Mechanochemical Polishing and Chemical Mechanical Polishing
Noncontact Polishing
Magnetoabrasive Finishing
Polishing Process Applying Electrophoretic Deposition
Electroabrasive Mirror Polishing Process
P-MAC Polishing
Colloidal Silica Polishing
References

CHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS; Toshiro K. Doi
Orientations and Role of CMP in Semiconductor Process
Basic Concept of Planarization CMP
Basic Technology of Planarization CMP
The Study Case of Device Wafer
Thin Film Magnetic Recording Heads
CMP of Compound Semiconductor Wafers
References
INDEX