Buch, Englisch, 286 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 700 g
ISBN: 978-3-03785-297-2
Verlag: Trans Tech Publications
Autoren/Hrsg.
Weitere Infos & Material
Preface, Sponsors and Committees
Chapter 1: Grinding Processes (1): Modeling and Surface Quality
Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique
Calculation of Effective Ground Depth of Cut by Means of Grinding Process Model
Grindability of Single Crystal Sapphire in Medical Use and the Scheme of Forming Highly Precise Spherical Heads
Error Size of the Helix (screw) Groove by Grinding
Influence of the Corrosion Surrounding on Surface Quality of Grounded Hardened Steels
Chapter 2: Special Session – Laser Manufacturing
New Laser Machine Tools for Processing Carbon Fibre Reinforced Plastic (CFRP)
Advanced Fiber Laser Perforation Technology for Thermoplastic Pre-Preg Material
Laser Assisted Micro Grinding of High Strength Materials
Transformation "Insulator-Conductor" after Laser Irradiation of the Polymer Films
Fibre Laser Cleaning of Grinding Wheels
Comparison of Picosecond and Femtosecond Laser Ablation for Surface Engraving of Metals and Semiconductors
Chapter 3: Cutting Tool Technology: Coatings
Ecologically Friendly Dry Machining by Cutting Tool from Layered Composition Ceramic with Nano-Scale Multilayered Coatings
Tool Coatings with the Effect of Adaptation to Cutting Conditions
The Influence of Machining Condition Forming Multilayer Coatings for Cutting Tools
Wear Resistance of Coatings for the Cutting Tool
High Speed Turning of Ti-6Al-4V Alloy with Straight Cemented Carbide and PVD Coated Carbide Tools
Chapter 4: Rotor Design and Vibratory Mass Finishing
Analysis of New Designs of Rotors with Variable Geometry Parameters and Results of their Tests
Investigation of Thermally Treated Recyled Glass as a Vibratory Mass Finishing Media
Chapter 5: Grinding Processes (2): Modeling and Surface Quality
Experimental Evaluation of Grinding Mechanism in Micro Depth of Cut
Thermodynamics of Precision Diamond Lapping of Ceramic Surfaces
Bearing Surfaces with Sapphire for Total Hip-Joint Replacement
A Model of Forming the Surface Layer of Ceramic Parts Based on Silicon Nitride in the Grinding Process
New Ways in Aluminium Alloys Grinding
Chapter 6: Advanced Manufacturing Technology: Cutting
Turning of Inconel 718 by Cemented Carbides
Pulsed Processes when Cutting Heat-Resistant Alloys
Single Point Diamond Turning of Single Crystal Silicon Carbide: Molecular Dynamic Simulation Study
An Investigation on Improved Theoretical Modelling for Surface Generation in Nanometric Cutting
Numerical Research of the Plastic Strain in Hard Turning in Case of Orthogonal Cutting
Theory and Practice of Technology for Machining Non-Rigid Smooth Shafts
Chapter 7: Precision Surfaces: Accuracy and Characterisation
Surface Integrity in Notches Machining
Reactive Atom Plasma for Rapid Figure Correction of Optical Surfaces
Optimizing Heat Transfer Rate in an Internally Cooled Cutting Tool: FE- Based Design Analysis and Experimental Study
Characterization of Topography of Cut Surface Based on Theoretical Roughness Indexes
Improved Accuracy of Console Boring of Deep Apertures
Chapter 8: Advanced Machining and Simulation (1)
Possibility of Reducing Environmental Load in Hard Machining
Influential Parameters in Determination of Chip Shape in High Speed Machining
Influence of Machining Process on Design Notch Performance
Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon
Chapter 9: Advanced Machining and Simulation (2)
Monitoring of Vibrations in the Technology of AWJ
The Application of Taguchi Approach to Optimise the Processing Conditions on Bonnet Polishing of CoCr
Multi-Pass Nanometric Machining Simulation Using the Molecular Dynamics (MD)
Analysis of Micro-Pin Manufacturing Using Inverse Slab Electrical Discharge Milling (ISEDM) Process
Chapter 10: Machining Technology: Drilling
Fine-Sized Spiral Drills with Variable Inclination Angle of Chip Grooves - Design and Manufacture
The Investigation of Thrust Force of Printed Circuit Board Drilling
