Nogita / Mohd Salleh / Abdullah | Electronic Packaging Interconnect Technology | Buch | 978-3-0357-1324-4 | sack.de

Buch, Englisch, 210 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 500 g

Nogita / Mohd Salleh / Abdullah

Electronic Packaging Interconnect Technology

Electronic Packaging Interconnect Technology Symposium (EPITS 2017)
Erscheinungsjahr 2018
ISBN: 978-3-0357-1324-4
Verlag: Trans Tech Publications

Electronic Packaging Interconnect Technology Symposium (EPITS 2017)

Buch, Englisch, 210 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 500 g

ISBN: 978-3-0357-1324-4
Verlag: Trans Tech Publications

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
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Autoren/Hrsg.

Nogita, Kazuhiro
Mohd Salleh, Mohd Arif Anuar
Abdullah, Mohd Mustafa Al Bakri
Jamaludin, Liyana
Mohd Tahir, Muhammad Faheem

Fachgebiete

Weitere Infos & Material

The Interaction of Sn-Ga Alloys and Au Coated Cu SubstratesEffect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave SolderFormation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid BondingGrain Refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu High Temperature Solder AlloysInfluence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder AlloySolidification Behavior of Sn Cu Based Peritectic Alloys: A Short ReviewInfluence of Bismuth in Sn-Based Lead-Free Solder ? A Short ReviewEffect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic SolutionCorrosion of Sn-Zn-Bi Lead Free Solder in KOH ElectrolyteCorrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl SolutionEffect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body FluidSynchrotron Radiography of Sn-0.7Cu-0.05Ni Solder SolidificationTensile Properties of Sn-Bi Lead-Free Solder AlloysEffect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate InterfaceComparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size SpecimensMicrostructure and Phase Analyses on the Corrosion of SAC305 Solder in Na?l SolutionSTEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic CompoundsEffect of Trace Elements on the Liquid Structure of Sn-Cu Alloys Investigated by High Energy X-Ray DiffractionPreliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker GrowthPalladium(II) Picoline Thiourea Complex as Homogenous Catalyst in Heck Cross-Coupling Reaction in the Formation of C=C BondAloe Vera Liquid Crystal Emulsion and Characterization of its Physical PropertiesDiffractografic Analysis of AISI 420 SteelSynthesis, Characterization and Crystal Structure of Coordination Polymers Developed as Anion ReceptorSynthesis and Characterization of Ag/TiO2 Thin Film via Sol-Gel MethodThe Effect of Temperature on Anatase TiO2 Photoanode for Dye Sensitized Solar CellManganese Substituted Iron Titanate Particles with Enhancement Adsorption Capacity for Removal of Remazol Brilliant Blue R DyeEvaluation of ICP-OES Method for Heavy Metal and Metalloids Determination in Sterile Dump MaterialThe Formation and Properties of Zeolite-A and Zeolite-X through Geopolymerisation of MetakaolinEffect of Geopolymer Coating on Mild SteelWettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond PlatesBrazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy

Eds. Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir

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