Buch, Englisch, 720 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 1089 g
Buch, Englisch, 720 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 1089 g
ISBN: 978-0-12-524985-0
Verlag: William Andrew Publishing
The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.
Zielgruppe
AUDIENCE: Industry and academic markets including electronics. Senior undergraduate or graduate students in electronics, especially interested students in electrical engineering, materials science, physics (or applied physics), chemistry, and mechanical and manufacturing engineering. Mature scientists and engineers entering the field. Professionals training to work in reliability, product assurance, and quality control departments in the industry.
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Zuverlässigkeitstechnik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
Weitere Infos & Material
An Overview of Electronic Devices and Their Reliability. Electronic Devices: How They Operate and Are Fabricated. Defects, Contaminants, and Yield. The Mathematics of Failure and Reliability. Mass Transport-Induced Failure. Electronic Charge-Induced Damage. Environmental Damage to Electronic Products. Packaging Materials, Processes and Stresses. Degradation of Contacts and Package Interconnections. Degradation and Failure of Electro-Optical Materials and Devices. Characterization and Failure Analysis of Materials and Devices. Future Directions and Reliability Issues.