The Materials Science of Thin Films

Erscheinungsjahr 1992
ISBN: 978-0-12-524990-4
Verlag: Elsevier Science & Technology

Buch, Englisch, 750 Seiten, Format (B × H): 152 mm x 229 mm

This is the first available textbook to provide comprehensive coverage of the science and technology of thin films and coatings. Developed for upper-level undergraduate and beginning graduate students, the book discusses physical and chemical vapor deposition processes; phenomena involving nucleation and growth, stress, diffusion and reaction; structural and chemical characterization techniques; and applications involving coatings, magnetic and optical recording materials, integrated optics, and quantum devices. The book includes chapters on epitaxy and surface modification in addition to discussing emerging technologies such as diamond films and high Tc superconductors. Complete problem sets are provided at the end of each chapter to facilitate self-study.

Autoren/Hrsg.

Ohring, Milton

Inhaltsverzeichnis

Review of Materials Science. Vacuum Science and Technology. Physical Vapor Deposition. Chemical Vapor Deposition. Film Formation and Structure. Characterization of Thin Films. Epitaxy. Interdiffusion and Reactions in Thin Films. Mechanical Properties of Thin Films. Electrical and Magnetic Properties of Thin Films. Optical Properties of Thin Films. Metallurgical and Protective Coatings. Modification of Surfaces and Films. Emerging Thin-Film Materials and Applications. Appendixes. Index.

Über Autor(innen)

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.