Buch, Englisch, 289 Seiten, HC runder Rücken kaschiert, Format (B × H): 160 mm x 241 mm, Gewicht: 1390 g
Buch, Englisch, 289 Seiten, HC runder Rücken kaschiert, Format (B × H): 160 mm x 241 mm, Gewicht: 1390 g
Reihe: Computational Microelectronics
ISBN: 978-3-211-40537-6
Verlag: Springer Vienna
Communication and information systems are subject to rapid and highly so phisticated changes. Currently semiconductor heterostructure devices, such as Heterojunction Bipolar Transistors (HBTs) and High Electron Mobility Transis tors (HEMTs), are among the fastest and most advanced high-frequency devices. They satisfy the requirements for low power consumption, medium integration, low cost in large quantities, and high-speed operation capabilities in circuits. In the very high-frequency range, cut-off frequencies up to 500 GHz [557] have been reported on the device level. HEMTs and HBTs are very suitable for high efficiency power amplifiers at 900 MHz as well as for data rates higher than 100 Gbitfs for long-range communication and thus cover a broad range of appli cations. To cope with explosive development costs and the competition of today's semicon ductor industry, Technology Computer-Aided Design (TCAD) methodologies are used extensively in development and production. As of 2003, III-V semiconductor HEMT and HBT micrometer and millimeter-wave integrated circuits (MICs and MMICs) are available on six-inch GaAs wafers. SiGe HBT circuits, as part of the CMOS technology on eight-inch wafers, are in volume production. Simulation tools for technology, devices, and circuits reduce expensive technological efforts. This book focuses on the application of simulation software to heterostructure devices with respect to industrial applications. In particular, a detailed discussion of physical modeling for a great variety of materials is presented.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Technische Wissenschaften Sonstige Technologien | Angewandte Technik Angewandte Optik
- Naturwissenschaften Physik Thermodynamik Oberflächen- und Grenzflächenphysik, Dünne Schichten
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikrowellentechnik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Mathematik | Informatik EDV | Informatik Programmierung | Softwareentwicklung Grafikprogrammierung
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
Weitere Infos & Material
1. Introduction.- 2. State-of-the-Art of Materials, Device Modeling, and RF Devices.- 2.1 State-of-the-Art of Heterostructure RF Device Modeling.- 2.2 State-of-the-Art of Heterostructure Devices and Optimization Potentials.- 3. Physical Models.- 3.1 Sets of Partial Differential Equations.- 3.2 Lattice and Thermal Properties.- 3.3 Band Structure.- 3.4 Carrier Mobility.- 3.5 Energy and Momentum Relaxation.- 3.6 Generation and Recombination.- 4. RF Parameter Extraction for HEMTs and HBTs.- 4.1 RF Parameter Extraction Methods.- 4.2 Contributions to the Small-Signal EquivalentCircuit Element.- 5. Heterojunction Bipolar Transistor.- 5.1 General Considerations.- 5.2 SiGe HBTs.- 5.3 High-Power GaAs HBTs.- 5.4 High-Speed InP HBTs.- 6. High Electron Mobility Transistor.- 6.1 General Considerations.- 6.2 High-Speed and High-Power AlGaAs/InGaAs PHEMTs.- 6.3 High-Speed InAlAs/InGaAs HEMTs on InP and GaAs.- 6.4 High-Power High-Speed AlGaN/GaN HEMTs.- 7. Novel Devices.- 7.1 InP DHBTs with GaAsSb Bases.- 7.2 AlGaN/GaN HBTs.- A. Appendix: Benchmark Structures.- Reference.- List of Figures.- List of Tables.
