Buch, Englisch, 754 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1462 g
Fundamentals and Application
Buch, Englisch, 754 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1462 g
Reihe: Springer Series in Materials Science
ISBN: 978-3-030-97276-9
Verlag: Springer International Publishing
This book provides a comprehensive introduction to all aspects of low-energy ion–solid interaction from basic principles to advanced applications in materials science. It features a balanced and insightful approach to the fundamentals of the low-energy ion–solid surface interaction, focusing on relevant topics such as interaction potentials, kinetics of binary collisions, ion range, radiation damages, and sputtering. Additionally, the book incorporates key updates reflecting the latest relevant results of modern research on topics such as topography evolution and thin-film deposition under ion bombardment, ion beam figuring and smoothing, generation of nanostructures, and ion beam-controlled glancing angle deposition. Filling a gap of almost 20 years of relevant research activity, this book offers a wealth of information and up-to-date results for graduate students, academic researchers, and industrial scientists working in these areas.
Zielgruppe
Graduate
Autoren/Hrsg.
Fachgebiete
- Naturwissenschaften Physik Quantenphysik Kernphysik
- Naturwissenschaften Physik Quantenphysik Atom- und Molekülphysik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Biomaterialien, Nanomaterialien, Kohlenstoff
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Oberflächenbeschichtung
Weitere Infos & Material
1. Introduction.- 2. Collision processes.- 3. Energy-loss processes and ion range.- 4. Ion beam induced damage.- 5. Sputtering.- 6. Evolution of topography under low-energy ion bombardment.- 7. Ion beam figuring and smoothing.- 8. Ion beam deposition.- 9. Ion beam assisted deposition.- 10. Ion beam sputtering induced glancing angle deposition.