Reinhardt / Reidy Handbook for Cleaning for Semiconductor Manufacturing

Fundamentals and Applications
1. Auflage 2011
ISBN: 978-1-118-07173-1
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 590 Seiten, E-Book

Reihe: Wiley-Scrivener

This comprehensive volume provides an in-depth discussion of thefundamentals of cleaning and surface conditioning of semiconductorapplications such as high-k/metal gate cleaning, copper/low-kcleaning, high dose implant stripping, and silicon and SiGepassivation. The theory and fundamental physics associated with wetetching and wet cleaning is reviewed, plus the surface andcolloidal aspects of wet processing. Formulation developmentpractices and methodology are presented along with the applicationsfor preventing copper corrosion, cleaning aluminum lines, and othersensitive layers. This is a must-have reference for any engineer ormanager associated with using or supplying cleaning andcontamination free technologies for semiconductor manufacturing.
From the Reviews...
"This handbook will be a valuable resource for many academiclibraries. Many engineering librarians who work with a variety ofprograms (including, but not limited to Materials Engineering)should include this work in their collection. My recommendation isto add this work to any collection that serves a campus with amaterials/manufacturing/electrical/computer engineering programsand campuses with departments of physics and/or chemistry withlarge graduate-level enrollment."
--Randy Wallace, Department Head, Discovery ParkLibrary, University of North Texas

Autoren/Hrsg.

Reinhardt, Karen A.

Reidy, Richard F.

Über Autor(innen)

Karen A. Reinhardt is Principle Consultant at Cameo Consultingin San Jose, California. Currently, Karen works with start-upcleaning companies to develop their technology for acquisition.Prior to forming a consulting company, Karen was employed atNovellus Systems, AMD, and Cypress Semiconductor. She has publishedmore than 30 technical publications, has been awarded sevenpatents, and is co-editor of Handbook of Silicon Wafer CleaningTechnology.
Richard F. Reidy (Ph.D., Penn State) is interim Chair andassociate professor of Material Science and Engineering at theUniversity of North Texas. He has conducted research ininterconnect processing and characterization with over 60 technicalpublications and three patents. He is a member of the InternationalTechnology Roadmap for Semiconductors.