Buch, Englisch, 396 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 757 g
Reihe: Electronics Handbook Series
Buch, Englisch, 396 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 757 g
Reihe: Electronics Handbook Series
ISBN: 978-0-8493-0082-0
Verlag: CRC Press
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible.
Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Zielgruppe
Professional
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Energietechnik | Elektrotechnik Technologien für Fossile Energieträger
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Brennstoffe, Kraftstoffe, Explosivstoffe
Weitere Infos & Material
Preface. Nomenclature and Symbology. Unit Conversion Factors. Introduction to Formulas for Thermal Design of Electronic Equipment. Formulas for Conduction Heat Transfer in Electronic Equipment. Formulas for Fluid Dynamics for Electronic Equipment. Convection Heat Transfer in Electronic Equipment. Radiation Heat Transfer in Electronic Equipment. Heat Transfer with Phase Change. Combined Modes of Heat Transfer for Electronic Equipment. Appendix.
