Buch, Englisch, 152 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 400 g
Buch, Englisch, 152 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 400 g
ISBN: 978-3-0364-0646-6
Verlag: Trans Tech Publications
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Preface
Investigation of Potential Impact of Nitridation Process on Single Event Gate Rupture Tolerance in SiC MOS Capacitors
Venus Surface Environmental Chamber Test of SiC JFET-R Multi-Chip Circuit Board
Coupled Non-Destructive Methods, Kelvin Force Probe Microscopy and µ-Raman to Characterize Doping in 4H-SiC Power Devices
Concept and Technology for Full Monolithic MOSFET and JBS Vertical Integration in Multi-Terminal 4H-SiC Power Converters
Comparing 4H-SiC NPN Buffer Layers by Epitaxial Growth and Implantation for Neural Interface Isolation
Modeling the Charging of Gate Oxide under High Electric Field
Complementary Two Dimensional Carrier Profiles of 4H-SiC MOSFETs by Scanning Spreading Resistance Microscopy and Scanning Capacitance Microscopy
Temperature Dependence of 4H-SiC Gate Oxide Breakdown and C-V Properties from Room Temperature to 500 °C
Detection of Very Fast Interface Traps at 4H-SiC/AlN and 4H-SiC/Al2O3 Interfaces
A Voltage Adjustable Diode Integrated SiC Trench MOSFET with Barrier Control Gate
Effects of High Gate Voltage Stress on Threshold Voltage Stability in Planar and Trench SiC Power MOSFETs
Design of Al2O3/LaAlO3/SiO2 Gate Stack on Various Channel Planes for High-Performance 4H-SiC Trench Power MOSFETs
Channel Density Design Guidelines for the Transient Characteristics of SiC Trench Gate MOSFETs
Analysis of On-State and Short-Circuit Capability in 3D Trench SiC MOSFET Designs
Revised Channel Mobility Model for Predictive TCAD Simulations of 4H-SiC MOSFETs
Improvement of Reflectance Spectroscopy for Oxide Layers on 4H-SiC
Doping and Temperature Dependence of Carrier Lifetime in 4H SiC Epitaxial Layers
Fail-to-Open Short Circuit Failure Mode of SiC Power MOSFETs: 2-D Thermo-Mechanical Modeling
Gate Resistance Integration in SiC MOSFETs: Performance Simulations under Different Implementation Methods
Fast Estimation of the Lateral Fidelity of Ion Implantation in 4H-SiC through Calibration to JFET Transfer Characteristics in TCAD