Wafers and Substrates

Erscheinungsjahr 2024
ISBN: 978-3-0364-0634-3
Verlag: Trans Tech Publications

Buch, Englisch, 114 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 340 g

This special collection examines the intrinsic properties of semiconductor wafers and substrates, their mechanical, electrical, and thermal characteristics, and also the latest developments in SiC wafer production and processing, substrate preparation, and their integration into high-tech products which are critical to the functionality and reliability of modern electronic devices. By bringing together research and practical insights, the special edition will be a valuable resource for scientists and industry specialists seeking to harness the full potential of silicon carbide in the evolving landscape of innovation in semiconductor technologies.

Autoren/Hrsg.

Riccio, Michele

Irace, Andrea

Breglio, Giovanni

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik

Inhaltsverzeichnis

Preface
SmartSiC™ Substrates: A Boon to Drain Metallization Process
Surface Structuring of Patterned 4H-SiC Surfaces Using a SiC/Si/SiC Sandwich Approach
HYPREZ Wafering Solutions: A Novel Approach of SiC Wafering Solution
Poly-SiC Characterization and Properties for SmartSiC™
Application of Advanced Characterization Techniques to SmartSiC™ Product for Substrate-Level Device Performance Optimization
A Novel Approach for Thin 4H-SiC Foil Realization Using Controlled Spalling from a 4H-SiC Wafer
High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils
Dicing Process for 4H-SiC Wafers by Plasma Etching Using High-Pressure SF6 Plasma with Metal Masks
Investigations on the Recovery of the Electrical Properties of Smart Cut™-Transferred SiC Thin Film Using SiC-on-Insulator Structures
Demonstration of SiC-on-Insulator Substrate with Smart Cut™ Technology for Photonic Applications
A Novel Contactless SiC Wafer Planarization Processing after Mechanical Slicing by Dynamic Thermal Annealing Processes
Proposal of Damage-Free SiC Wafer Dicing Using Water Jet Guided Laser
In-Line Charaterization of HPSI SiC Wafers Using High Resolution Surface Photovoltage Spectroscopy (HR-SPS)
Characterization of Very Thin 3C-SiC Epilayers on Si