Buch, Englisch, 105 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 189 g
Buch, Englisch, 105 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 189 g
Reihe: SpringerBriefs in Mathematics
ISBN: 978-3-030-35536-4
Verlag: Springer International Publishing
This book presents asymptotic methods for boundary-value problems (linear and semilinear, elliptic and parabolic) in so-called thick multi-level junctions. These complicated structures appear in a large variety of applications.
A concise and readable introduction to the topic, the book provides a full review of the literature as well as a presentation of results of the authors, including the homogenization of boundary-value problems in thick multi-level junctions with non-Lipschitz boundaries, and the construction of approximations for solutions to semilinear problems.Including end-of-chapter conclusions discussing the results and their physical interpretations, this book will be of interest to researchers and graduate students in asymptotic analysis and applied mathematics as well as to physicists, chemists and engineers interested in processes such as heat and mass transfer.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Mathematik | Informatik Mathematik Numerik und Wissenschaftliches Rechnen Angewandte Mathematik, Mathematische Modelle
- Mathematik | Informatik Mathematik Mathematische Analysis Differentialrechnungen und -gleichungen
- Naturwissenschaften Physik Physik Allgemein Theoretische Physik, Mathematische Physik, Computerphysik
- Mathematik | Informatik Mathematik Mathematische Analysis Funktionalanalysis
Weitere Infos & Material
1 Introduction.- 2 Homogenization of Linear Elliptic Problems.- 3 Homogenization of Elliptic Problems in Thick Junctions with Sharp Edges.- 4 Homogenization of Semilinear Parabolic Problems.- 5 Asymptotic Approximations for Solutions to Semilinear Problems.- References.