Electroless Copper and Nickel-Phosphorus Plating

Processing, Characterisation and Modelling
Erscheinungsjahr 2016
ISBN: 978-0-08-101497-4
Verlag: Elsevier Science & Technology

Buch, Englisch, 304 Seiten, Gewicht: 430 g

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

Autoren/Hrsg.

Sha, W

Wu, Xiaomin

Keong, K G

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Metallurgie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Metallische Werkstoffe
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Oberflächenbeschichtung

Inhaltsverzeichnis

1. Introduction to electroless copper and nickel-phosphorus (Ni-P) depositions

Part I: Electroless copper depositions2. Surface morphology evolution of electroless copper deposits3. Cross-section of electroless copper deposits and the void fraction4. Crystal structure and surface residual stress of electroless copper deposits5. The atomic model of the diamond pyramid structure in electroless copper deposits6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits7. Adhesion strength of electroless copper deposit to epoxy board8. Electrical resistivity of electroless copper deposit9. Applications of electroless copper deposits

Part II: Electroless nickel-phosphorus (Ni-P) depositions10. Crystallisation of nickel-phosphorus (Ni-P) deposits with high phosphorus content11. Crystallisation of nickel-phosphorus (Ni-P) deposits with medium and low phosphorus content12. Modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus (Ni-P) deposits13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel-phosphorus deposits14. Hardness evolution of nickel-phosphorus (Ni-P) deposits with thermal processing15. Applications of electroless nickel-phosphorus (Ni-P) plating

Über Autor(innen)

Sha, W
Professor Wei Sha is Professor of Materials Science at The Queen's University of Belfast, UK

Keong, K G
Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.