Shabany Heat Transfer

Thermal Management of Electronics
1. Auflage 2011
ISBN: 978-1-4398-1468-0
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 523 Seiten

The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.

Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase.

The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods.

With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.

Zielgruppe

Current and future engineers working in the electronics industry

Autoren/Hrsg.

Shabany, Younes

Fachgebiete

• Geisteswissenschaften Design Produktdesign, Industriedesign
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik
• Naturwissenschaften Physik Thermodynamik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Verpackungstechnik

Inhaltsverzeichnis

Introduction
Semiconductor Technology Trends
Temperature-Dependent Failures
Importance of Heat Transfer in Electronics
Thermal Design Process


Energy, Energy Transfer, and Heat Transfer
Energy and Work
Macroscopic and Microscopic Energies
Energy Transfer and Heat Transfer
Equation of State


Principle of Conservation of Energy
First Law of Thermodynamics
Energy Balance for a Control Mass
Energy Balance for a Control Volume


Heat Transfer Mechanisms
Conduction Heat Transfer
Convection Heat Transfer
Radiation Heat Transfer


Thermal Resistance Network
Thermal Resistance Concept
Series Thermal Layers
Parallel Thermal Layers
General Resistance Network
Thermal Contact Resistance
Thermal Interface Materials
Spreading Thermal Resistance
Thermal Resistance of Printed Circuit Boards (PCBs)


Thermal Specification of Microelectronic Packages
Importance of Packaging
Packaging Types
Thermal Specifications of Microelectronic Packages
Package Thermal Resistance Network
Parameters Affecting Thermal Characteristics of a Package


Fins and Heat Sinks
Fin Equation
Fin Thermal Resistance, Effectiveness, and Efficiency
Fins with Variable Cross Sections
Heat Sink Thermal Resistance, Effectiveness, and Efficiency
Heat Sink Manufacturing Processes


Heat Conduction Equation
One-Dimensional Heat Conduction Equation for a Plane Wall
General Heat Conduction Equation
Boundary and Initial Conditions
Steady-State Heat Conduction
Transient Heat Conduction
Lumped Systems


Fundamentals of Convection Heat Transfer
Types of Flows
Viscous Force, Velocity Boundary Layer, and Friction Coefficient
Temperature Boundary Layer and Convection Heat Transfer Coefficient
Conservation Equations
Boundary Layer Equations


Forced Convection Heat Transfer: External Flows
Normalized Boundary Layer Equations
Reynolds Number, Prandtl Number, Eckert Number, and Nusselt Number
Functional Forms of Friction Coefficient and Convection Heat Transfer Coefficient
Flow Over Flat Plates
Flow Across Cylinders
Cylindrical Pin-Fin Heat Sink
Procedure for Solving External Forced Convection Problems


Forced Convection Heat Transfer: Internal Flows
Mean Velocity and Mean Temperature
Laminar and Turbulent Pipe Flows
Entry Length and Fully Developed Flow
Pumping Power and Convection Heat Transfer in Internal Flows
Velocity Profiles and Friction Factor Correlations
Temperature Profiles and Convection Heat Transfer Correlations
Fans and Pumps
Plate-Fin Heat Sinks
Problems


Natural Convection Heat Transfer
Buoyancy Force and Natural Convection Flows
Natural Convection Velocity and Temperature Boundary Layers
Normalized Natural Convection Boundary Layer Equations
Laminar and Turbulent Natural Convection over a Vertical Flat Plate
Natural Convection Around Inclined and Horizontal Plates
Natural Convection Around Vertical and Horizontal Cylinders
Natural Convection in Enclosures
Natural Convection from Array of Vertical Plates
Mixed Convection


Radiation Heat Transfer
Radiation Intensity and Emissive Power
Blackbody Radiation
Radiation Properties of Surfaces
Solar and Atmospheric Radiations
Radiosity
View Factors
Radiation Heat Transfer Between Black Bodies
Radiation Heat Transfer Between Non-Black Bodies
Radiation Heat Transfer from a Plate-Fin Heat Sinks


Computer Simulations and Thermal Design
Heat Transfer and Fluid Flow Equations: A Summary
Fundamentals of Computer Simulation
Turbulent Flows
Solution of Finite-Difference Equations
Commercial Thermal Simulation Tools
Importance of Modeling and Simulation in Thermal Design


Experimental Techniques and Thermal Design
Flow Rate Measurement Techniques
System Impedance Measurement
Fan and Pump Curve Measurements
Velocity Measurement Methods
Temperature Measurement Techniques
Acoustic Noise Measurements
Importance of Experimental Measurements in Thermal Design


Advanced Cooling Techniques
Heat Pipes
Liquid Cooling
Thermoelectric Coolers
Electrohydrodynamic Flow
Synthetic Jet


Appendices

Index

Über Autor(innen)

Younes Shabany received his BS in mechanical engineering from Sharif University of Technology in Tehran, Iran, in 1991. He then went to Vancouver, Canada where he obtained his MS in mechanical engineering from the University of British Columbia in 1994. He came to the United States and received a Ph.D in mechanical engineering with a minor in aeronautics and astronautics from Stanford University, California, in 1999. Dr. Shabany has over 18 years of experience in thermal-fluid engineering. He is currently Director of Thermal Engineering & Design and Thermal Architect in Advanced Technology Group at Flextronics International USA, Milpitas, California. In this position, he has been leading thermal design activities in Flextronics’ worldwide design centers on a variety of infrastructure, computing, consumer, automobile, medical, and power electronic products. Before Flextronics, he worked for Applied Thermal Technologies, Santa Clara, California, where he was the director for two years. While at Applied Thermal Technologies, he worked with over 60 companies and designed thermal solutions for about as many pieces of electronic equipment including telecom and networking equipment, desktop and laptop computers, biomedical equipment, and consumer products. Dr. Shabany has also been a lecturer at San Jose State University, California, since the summer of 2001. He has taught undergraduate and graduate courses in heat transfer and advanced mathematical analysis including his most favorite course, Heat Transfer in Electronics. He has also advised graduate students on their projects and theses.