van Beurden / Schilders / Budko | Scientific Computing in Electrical Engineering | Buch | 978-3-030-84237-6 | sack.de

Buch, Englisch, 311 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 664 g

Reihe: The European Consortium for Mathematics in Industry

van Beurden / Schilders / Budko

Scientific Computing in Electrical Engineering

SCEE 2020, Eindhoven, The Netherlands, February 2020
1. Auflage 2021
ISBN: 978-3-030-84237-6
Verlag: Springer International Publishing

SCEE 2020, Eindhoven, The Netherlands, February 2020

Buch, Englisch, 311 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 664 g

Reihe: The European Consortium for Mathematics in Industry

ISBN: 978-3-030-84237-6
Verlag: Springer International Publishing


The conference has an interdisciplinary focus and aims to bring together scientists – mathematicians, electrical engineers, computer scientists, and physicists, from universities and industry – to have in-depth discussions of the latest scientific results in Computational Science and Engineering relevant to Electrical Engineering and to stimulate and inspire active participation of young researchers.

van Beurden / Schilders / Budko Scientific Computing in Electrical Engineering jetzt bestellen!

Zielgruppe


Research

Weitere Infos & Material


Part I Circuit Simulation and Design.- Efficient model reduction of myelinated compartments as port-Hamiltonian systems.- Towards a Parallel-in-Time Calculation of Time-Periodic Solutions with Unknown Period.- On the Exactness of Rational Polynomial Chaos Formulation for the Uncertainty Quantification of Linear Circuits in the Frequency Domain.- Parallel-in-Time Simulation of Power Converters Using Multirate PDEs.- Part II Device Simulation.- A Maximum Principle for Drift-Diffusion Equations and the Scharfetter-Gummel Discretization.- Numerical calculation of electronic properties of transition metal-doped mWS via DFT.- Numerical simulation of thermal conductivity of silicon nanowires.- A Novel Surface Mesh Simplification Method for Flux-Dependent Topography Simulations of Semiconductor Fabrication Processes.- Simulations of a novel DG-GFET.- Part III Computational Electromagnetics.- Electric Circuit Element Boundary Conditions in the Finite Element Method for Full-Wave Frequency Domain Passive Devices.- A convolution quadrature method for Maxwell’s equations in dispersive media.- On the stability of harmonic coupling methods with application to electric machines.- Dielectric Breakdown Prediction with GPU-Accelerated BEM.- Empirical Analysis of a Coaxial Microwave Structure with Finite Transmission Zero.- Frequency-domain non-intrusive greedy Model Order Reduction based on minimal rational approximation.- A Comparison Between Different Formulations for Solving Axisymmetric Time-Harmonic Electromagnetic Wave Problems.- The Magnetization Analysis of Motor Magnet and its Influence on Cogging Torque.- Part IV Mathematical and Computational Methods.- A Combination of Model Order Reduction and Multirate Techniques for Coupled Dynamical Systems.- Waveform relaxation for low frequency coupled field/circuit differential-algebraic models of index 2.- Splitting Methods for Linear Circuit DAEs of Index 1 in port-Hamiltonian Form.- Reduced order modelling for wafer heating with the Method of Freezing.- Multirate DAE-Simulation and its Application in System Simulation Software for the Development of Electric Vehicles.- A hysteresis loss model for Tellinen’s scalar hysteresis model.- Hybrid Modeling: Towards the Next Level of Scientific Computing in Engineering.- Machine Learning for Initial Value Problems of Parameter-Dependent Dynamical Systems.- Modeling of Thermoelectric Generator via Parametric Model Order Reduction Based on Modified Matrix Interpolation.- Nonlinear Model Order Reduction of a Thermal Human Torso Model.- Multi-Level Iterations for Microgrid Control with Automatic Level Choice.- Multi-Level Inversion Based On Mesh Decoupling.



Ihre Fragen, Wünsche oder Anmerkungen
Vorname*
Nachname*
Ihre E-Mail-Adresse*
Kundennr.
Ihre Nachricht*
Lediglich mit * gekennzeichnete Felder sind Pflichtfelder.
Wenn Sie die im Kontaktformular eingegebenen Daten durch Klick auf den nachfolgenden Button übersenden, erklären Sie sich damit einverstanden, dass wir Ihr Angaben für die Beantwortung Ihrer Anfrage verwenden. Selbstverständlich werden Ihre Daten vertraulich behandelt und nicht an Dritte weitergegeben. Sie können der Verwendung Ihrer Daten jederzeit widersprechen. Das Datenhandling bei Sack Fachmedien erklären wir Ihnen in unserer Datenschutzerklärung.