E-Book, Englisch, 434 Seiten
Reihe: Woodhead Publishing Series in Electronic and Optical Materials
Zhang / Che / Lin Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
1. Auflage 2019
ISBN: 978-0-08-102533-8
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark
E-Book, Englisch, 434 Seiten
Reihe: Woodhead Publishing Series in Electronic and Optical Materials
ISBN: 978-0-08-102533-8
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Dr. Hengyun Zhang is a professor in Shanghai University of Engineering Science. He has worked in industry and research institutes for 16 years, including Institute of Microelectronics (Singapore), Advanced Micro Devices and Dow Corning. He was the recipient of the Best Poster Paper award from ITHERM 2004, AMD Engineering Excellence Award 2008, and Best Paper award from Icept 2010. He has nearly 70 publications in international journals and conferences, and more than 24 patents granted/filed of thermal and packaging significance. He also served in a number of international conferences as a committee member (ITHERM, ICEPT, EPTC, MNHMT etc). He was a speaker in IME Industry Forums on thermal packaging and the project leader for more than ten research projects. His current interests include thermal management and electronics packaging.
