Buch, Englisch, 566 Seiten, Format (B × H): 156 mm x 234 mm, Gewicht: 2200 g
Buch, Englisch, 566 Seiten, Format (B × H): 156 mm x 234 mm, Gewicht: 2200 g
Reihe: Solid Mechanics and Its Applications
ISBN: 978-1-4020-4934-7
Verlag: Springer
From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research.
Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Kontinuumsmechanik
- Technische Wissenschaften Technik Allgemein Mathematik für Ingenieure
- Mathematik | Informatik EDV | Informatik Angewandte Informatik Computeranwendungen in Wissenschaft & Technologie
- Mathematik | Informatik EDV | Informatik Professionelle Anwendung Computer-Aided Design (CAD)
- Technische Wissenschaften Technik Allgemein Computeranwendungen in der Technik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau
Weitere Infos & Material
Microelectronics Technology.- Reliability Practice.- Thermal Management.- to Advanced Mechanics.- Thermo-Mechanics of Integrated Circuits and Packages.- Characterization and Modelling of Moisture Behaviour.- Characterization and Modelling of Solder Joint Reliability.- Virtual Thermo-Mechanical Prototyping.- Challenges and Future Perspectives.
