Al Bakri Abdullah / Yahya / Mohd Salleh | Innovative Materials and Technologies | Sonstiges | 978-3-03859-467-3 | sack.de

Sonstiges, Englisch, Band Volume 700, 278 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

Reihe: Key Engineering Materials

Al Bakri Abdullah / Yahya / Mohd Salleh

Innovative Materials and Technologies

Sonstiges, Englisch, Band Volume 700, 278 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

Reihe: Key Engineering Materials

ISBN: 978-3-03859-467-3
Verlag: Trans Tech Publications


This special issue aims to provide a high level research paper for researchers, engineers and scientists to present their new advances and research results in the field of materials and innovative technologies for mechanical engineering, construction electronic packaging.
Al Bakri Abdullah / Yahya / Mohd Salleh Innovative Materials and Technologies jetzt bestellen!

Weitere Infos & Material


Characterization and Microstructure of Kaolin-Based Ceramic Using GeopolymerizationApplication of RSM to Optimize Moulding Conditions for Minimizing Shrinkage in Thermoplastic ProcessingSynthesis and Characterization of Ni0.8Zn0.2Fe2O4 Nanoparticles by Self-Combustion TechniqueImproving Warpage with Milled Groove Square Shape Conformal Cooling ChannelsMonomeric Structure Characterization of Different Sources Biomass LigninEffects of Acid on the Performance of Polishing ProcessUtilization of Modified Palm Kernel Shell for Biocomposites ProductionThe Analysis of Physical-Structural Properties for AISI 321 SteelThe Analysis of Metallic Materials Subjected to Cycles of Thermal and Mechanical FatigueStructural Analysis of CoCrMoSi6 Alloy Used in Medical ApplicationsTransverse and Longitudinal Flexural Properties of Untreated and Maleic Anhydride Treated Kenaf Bast Fiber Reinforced Unsaturated Polyester CompositesFabrication Method of Aluminum Matrix Composite (AMCs): A ReviewEffect of Thermal Aging on the Interfacial of Sn-Zn and Sn-Zn-Bi Solders Joint on Cu SubstrateIsothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder PasteBondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation ApproachEffect of Bi and In on Microstructure Formation in Sn-3Ag-3Bi-3In/Cu and /Ni Solder JointsWettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite SolderEffect of TiO2 on the Formation of Primary and Interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during SolderingDevelopment of Drainage Material Using Rice Husk Cement Mortar with FoamA Review on Fly Ash Based Geopolymer Rubberized ConcreteEffect of Antioxidant Characteristic from Waste Cooking Oil in Modified Asphalt BinderChemical Identification of Waste Cooking Oil as Additive in BitumenPerformance of Waste Cooking Oil in Asphalt Binder ModificationThe Influence of Coconut Shell as Coarse Aggregates in Asphalt MixtureThe Performance of Styrene Butadiene Rubber on the Engineering Properties of Asphaltic Concrete AC14Site Planning and Orientation for Energy Efficiency: A Comparative Analysis on Three Office Buildings in Kuala Lumpur to Determine a Location for Building Shading DeviceA Comparative Analysis on Materials and Resources in Green Assessment Tools for Various Countries


Eds. M.M. Al Bakri Abdullah, Z. Yahya and M.A.A. Mohd Salleh


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