Bokstein / Rodin / Straumal | Grain Boundary Diffusion, Stresses and Segregation | Sonstiges | 978-3-03785-056-5 | sack.de

Sonstiges, Englisch, 308 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

Bokstein / Rodin / Straumal

Grain Boundary Diffusion, Stresses and Segregation


Erscheinungsjahr 2011
ISBN: 978-3-03785-056-5
Verlag: Trans Tech Publications

Sonstiges, Englisch, 308 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

ISBN: 978-3-03785-056-5
Verlag: Trans Tech Publications


This special collection concentrates on three basic topics, the 35 peer-reviewed papers being grouped into: 1. Grain Boundary Diffusion, Segregation and Stresses, 2. Bulk Diffusion and Phase Formation and 3. Diffusion-Controlled Processes. It provides succinct and timely coverage of these topics.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
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Weitere Infos & Material


Recent Advances and Unsolved Problems of Grain Boundary DiffusionThe Harrison Diffusion Kinetics Regimes in Grain Boundary Diffusion: Lattice Monte Carlo Modelling of the Effect of SegregationStress Generation during Grain Boundary InterdiffusionConcentration Profiles for Grain Boundary Diffusion in B-Regime with Regard to the Formation of Atomic Complexes in Grain BoundaryRecent Developments in the Study of Grain Boundary Segregation by Wavelength Dispersive X-Ray Spectroscopy (WDS)Self-Diffusion Parameters of Grain Boundaries and Triple Junctions in Nanocrystalline MaterialsGrain Boundary Segregation and Amount of Bulk Carbides in Severely Deformed Fe?C AlloysNumerical Simulation Support for Diffusion Coefficient Measurements in Polycrystalline Thin FilmsCu GB Diffusion in Al. Effect of Alloying by Cu and CeRound Table Discussion ?Grain Boundary Diffusion: Experiments and Modeling? DSS 2010, 1-4 June, MoscowDiffusion in Solids under PressureEffect of Diffusion Induced Driving Forces on Interdiffusion - Stress Development/Relaxation and Kinetics of Diffusion ProcessesSegregation in Single-Crystal Nickel-Base SuperalloysReactive Diffusion upon Planar Dissolving Copper in Solder MeltsModels of Interdiffusion in a Polycrystalline Alloy: Kirkendall Effect versus Non-Equilibrium Vacancies and BackstressDiffusion in Point Contact ReactionPre-Stressed Sub-Surface Contribution on Bulk Diffusion in Metallic SolidsThe Effect of Plastic Deformation on Nitrogen Diffusion in a-FeRedistribution of Alloy Elements during Nickel Silicide Formation: Benefit of Atom Probe TomographyDiffusion Phase Formation in the Cu-Sn Nanofilms SystemUnprecedented Wealth of Information on Guest Dynamics in Nanoporous Materials from Transient Concentration ProfilesDiffusion-Induced Recrystallization in Nickel/Palladium MultilayersSegregation and Selective Surface Oxidation at the Intermediate Steps of Recrystallization AnnealingThermally Activated Relaxation and Hysteretic Internal Friction in Ultrafine Grained CopperRole of Finite Vacancy Relaxation Rate at SHS Reactions in Nanosized MultilayersComputer Simulation of Fe Diffusion in Liquid Al and along Al Grain BoundariesDiffusion Controlled Grain Triple Junctions Wetting in MetalsDiffusion Spreading of the Emitted Metallurgical GasCritical Embrittlement Temperature for Tube Steels Used at Atomic Power StationsFabrication and Microstructure of Al-Based Hybrid Composite Reinforced by B4C and Ultra-Dispersed TungstenGallium Distribution in Gallium-Coated Aluminum for Brazing ApplicationThermodynamic and Kinetic Study of Leaching Magnesia from Natural Magnesites by Carbon DioxideThe Liquid Bismuth Penetration from Solid Bi2Te3: Grain Boundary Embrittlement and Effect of ImpuritiesLow-Temperature Synthesis of Perovskites PbTiO3 and PbZrO3Thermodynamically Consistent Formulation of the Sedimentation in Solids and Liquids


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