E-Book, Englisch, 416 Seiten
Boudreau Passive Micro-Optical Alignment Methods
Erscheinungsjahr 2018
ISBN: 978-1-4200-2772-3
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
E-Book, Englisch, 416 Seiten
Reihe: Optical Science and Engineering
ISBN: 978-1-4200-2772-3
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
The most expensive phase in the manufacture of micro-optical components and fiber optics is also one of the most performance-critical: optical alignment of the components. The increasing degree of miniaturization makes this an especially challenging task. Active alignment methods result in higher costs and awkward processes, and for some applications, they simply are not possible. Passive Micro-Optical Alignment Methods introduces the passive alignment methods that are currently available and illustrates them with many examples, references, and critiques.
The first book dedicated to passive alignment, it begins with an overview of the current activities, requirements, and general results of passive optical alignments, followed by three sections of in-depth analysis. The first of these discusses mechanical passive alignment, highlighting silicon waferboard, solder, and "Jitney" technologies as well as application of mechanical alignment to 3D free-space interconnects. The next section describes the various visual alignment techniques applied to Planar Lightwave Circuits (PLCs) and low-cost plastic and surface mount packaging. The final section details various utilities that aid passive alignment and their resulting tradeoffs and demonstrates Monte Carlo analysis to evaluate the potential of a given method.
Passive Micro-Optical Alignment Methods provides the tools necessary to meet the challenge of precision and low-cost alignment for applications that require micron or sub-micron tolerance.
Zielgruppe
Manufacturers of optoelectronics and fiber optic components, engineers of analytical instrumentation such as biotechnology equipment, optical and MEMS engineers, manufacturers using micromachining, nano- and micro-technologists, materials scientists, and students and researchers in these areas.
Autoren/Hrsg.
Weitere Infos & Material
Preface
OVERVIEW
Overview of Passive Optical Alignment; R.A. Boudreau, S.M. Boudreau, and K. Matthews
MECHANICAL PASSIVE ALIGNMENT
Passive Alignment in Connectors and Splices; J. Kevern and A. Plotts
Mechanical Passive Alignment I; S. Tan, H. Han, and R.A. Boudreau
Silicon Waferboard Mechanical Passive Alignment II; W. Hunziker and W. Vogt
Solder Technology for Optoelectronic Packaging; Q. Tan, Y-C. Lee, and M. Itoh
Plastic-Based Passive Optical Alignment: The Jitney Parallel Optical Interconnect; S.M. Boudreau
Mechanical Methods for Free Space Passive Alignment; N. Basavanhally
VISUAL PASSIVE ALIGNMENT
Solder-Bump and Visual Passive Alignment Technologies for Optical Modules; Y. Yamada, T. Hayashi, Y. Akahori, H. Tsunetsugu, and K. Katoh
Passive Alignment for Surface Mount Packaging and a Low-Cost Plastic Packaged Optical Module as an Application of the Passive Optical Alignment Method; K. Kurata and K. Tatsuno
UTILITIES FOR PASSIVE ALIGNMENT
Large Spot Devices, Mode Transformers, and Optics; J.V. Collins
Monte Carlo Analysis of Passive Alignment Methods; R.B. Wilson