Comprehensive Microsystems

2. Auflage 2025
ISBN: 978-0-323-95478-5
Verlag: William Andrew Publishing

Medienkombination, Englisch, Format (B × H): 216 mm x 276 mm

The microsystems field has expanded to embrace a host of technologies, and microelectronics has now been joined by micro-mechanics, micro-fluidics and micro-optics to allow the fabrication of complex, multi- functional integrated microsystems. Comprehensive Microsystems, Second Edition, 3 volume set, represents the authoritative primary reference source on microsystems and is now newly updated to reflect the latest advances in this exciting engineering field. This major reference work provides an exhaustive overview of the range of topics which comprise the microsystems field, including, design and materials, fabrication and packaging, optical systems, chemical and biological systems, physical sensors, actuation, electronics for MEMS and industrial applications. The new edition has been considerably revised and updated to include newer technologies such as ultrafast laser machining, 3D printing for biomedical applications, wearable sensors, microanalytical systems, and more. Each expertly written article provides a concise overview of a particular aspect of microsystems, and is accompanied by extensive references, guiding the user to the most relevant further reading within the ever-expanding available literature.

Autoren/Hrsg.

Weitere Mitwirkende

Gianchandani, Yogesh B.

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Verfahrenstechnik, Chemieingenieurwesen
• Naturwissenschaften Chemie Chemie Allgemein
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau

Inhaltsverzeichnis

Materials Fabrication and Packaging Electronics and Systems Design Actuation Mechanism Physical Sensing Chemical and Biological Systems Optical Systems Industrial Applications Emerging Topics

Über Autor(innen)

Gianchandani, Yogesh B.
Yogesh B. Gianchandani is a Professor at the University of Michigan, Ann Arbor, in the Department of Electrical Engineering and Computer Science, with a courtesy appointment in the Mechanical Engineering Department. He also serves as the Director for the Engineering Research Center for Wireless Integrated Microsystems (WIMS). Dr. Gianchandani's research interests include the design, fabrication, and packaging of micromachined sensors and actuators. He is a fellow of IEEE and serves as an editor or board member of several journals.