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Choi / Jeong / Xu Advances in Abrasive Technology XVIII
Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.The 114 papers are grouped as follows:Chapter 1: GrindingChapter 2: Abrasive Jet MachiningChapter 3: Advanced Cutting TechnologyChapter 4: Processing of Brittle MaterialsChapter 5: Chemical Mechanical Polishing, Processing of Semiconductor WaferChapter 6: Electrical Discharge Machining, Ultrasonic and Beam MachiningChapter 7: Finishing, Lapping and PolishingChapter 8: Surface and Subsurface Integrity and Materials CharacterizationChapter 9: In-Process Measurement and Monitoring, MetrologyChapter 10: Machine Tools and Systems, Tooling ProcessingErscheinungsjahr 2016Verlag: Trans Tech PublicationsISBN: 978-3-03835-651-6Medium: BuchLieferzeit ca. 10 Werktage -
Choi / Jeong / Xu Advances in Abrasive Technology XVIII
Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.The 114 papers are grouped as follows:Chapter 1: GrindingChapter 2: Abrasive Jet MachiningChapter 3: Advanced Cutting TechnologyChapter 4: Processing of Brittle MaterialsChapter 5: Chemical Mechanical Polishing, Processing of Semiconductor WaferChapter 6: Electrical Discharge Machining, Ultrasonic and Beam MachiningChapter 7: Finishing, Lapping and PolishingChapter 8: Surface and Subsurface Integrity and Materials CharacterizationChapter 9: In-Process Measurement and Monitoring, MetrologyChapter 10: Machine Tools and Systems, Tooling ProcessingErscheinungsjahr 2016Verlag: Trans Tech PublicationsISBN: 978-3-0357-0132-6Medium: eBookFormat: PDF
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Choi / Jeong / Xu Advances in Abrasive Technology XVIII
Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.The 114 papers are grouped as follows:Chapter 1: GrindingChapter 2: Abrasive Jet MachiningChapter 3: Advanced Cutting TechnologyChapter 4: Processing of Brittle MaterialsChapter 5: Chemical Mechanical Polishing, Processing of Semiconductor WaferChapter 6: Electrical Discharge Machining, Ultrasonic and Beam MachiningChapter 7: Finishing, Lapping and PolishingChapter 8: Surface and Subsurface Integrity and Materials CharacterizationChapter 9: In-Process Measurement and Monitoring, MetrologyChapter 10: Machine Tools and Systems, Tooling ProcessingErscheinungsjahr 2016Verlag: Trans Tech PublicationsISBN: 978-3-03859-447-5Medium: SonstigesLieferzeit ca. 10 Werktage
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