Buch, Englisch, 450 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 840 g
Buch, Englisch, 450 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 840 g
ISBN: 978-0-323-91224-2
Verlag: William Andrew Publishing
Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances.
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
1. Applications and Key Performance Indicators for Data Communications 2. Integrated Semiconductor Lasers 3. Integrated Optical Modulators 4. Integrated Photodetectors 5. Passive Silicon Photonic Devices 6. Coherent PICs for Data Center Interconnects 7. PICs for switched network interconnects 8. Photonics Switch Fabrics in Datacentre/HPC networks 9. PICs and Optical Fabrics for Heterogenous Compute Systems 10. PIC Design Methods and Tools 11. PIC Fabrication, and Test Approaches 12. PIC Packaging & Test Technologies for DC and HPC Applications 13. PIC Quality and Reliability for DC and HPC Applications