Sonstiges, Englisch, Band Volume 528, 224 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g
Reihe: Key Engineering Materials
Sonstiges, Englisch, Band Volume 528, 224 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g
Reihe: Key Engineering Materials
ISBN: 978-3-03795-316-7
Verlag: Trans Tech Publications
Volume is indexed by Thomson Reuters CPCI-S (WoS).
A series of papers was devoted to the processes of metal-forming. Special attention was paid to the question of micro- and nano-structure adjustment during processes such as extrusion and microtube press-bending. Other papers covered models for damage accumulation and healing, as well as fracture prediction during metal forming.
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Weitere Infos & Material
Ductile Fracture in Metal Forming: A Review of Selected IssuesPropagation of Random Waves in Elastic Media with MicroheterogeneitiesFinite Element Analyses of Extrusion with a Two Stage Die and Manufacturing of Gradient Micro-StructuresSome Mechanical Models of Chemical-Mechanical Polishing ProcessesFluid Flow Control in Micro- and NanochannelsBulk and Surface Stability of MaterialsAccumulation and Healing of Damage during Plastic Metal Forming Simulation and ExperimentA Correlation between the Magnetic Behaviour and Damage of Metal Materials under Plastic DeformationsLimit Plastic State of Notched Stripes with Stress State Dependent PropertiesModes of Stability Loss of MaterialsIdentification of Defects in an Elastic Body by Means of the Boundary MeasurementsEffect of Strain-Hardening Induced Grain Refinement on Springback in Microtube Press Bending ProcessInvestigation of the Asymptotic Behavior of Stresses at the Tip of Wedge- and Cone-Shaped Cracks3-D Model of the Periodic Structure Punch Sliding upon the Viscoelastic Base with Incompressible Fluid in the Contact GapGrain Refinement of AZ61/SiCp Magnesium Matrix Composites for Tubes Extruded by Hot Extrusion ProcessesTheory of Phase Transformations in the Mechanics of Solids and its Applications for Description of Fracture, Formation of Nanostructures and Thin Semiconductor Films GrowthDevelopment of Innovative Algorithm for Nanomechanics and its Applications to the Characterization of Materials