Huang / Zhang / Wang | Advances in Abrasive Technology XII | Sonstiges | 978-3-908454-62-5 | sack.de

Sonstiges, Englisch, 752 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

Huang / Zhang / Wang

Advances in Abrasive Technology XII

Sonstiges, Englisch, 752 Seiten, Format (B × H): 125 mm x 142 mm, Gewicht: 200 g

ISBN: 978-3-908454-62-5
Verlag: Trans Tech Publications


Volume is indexed by Thomson Reuters CPCI-S (WoS).
Abrasive technologies are central to modern manufacturing as applied to a wide variety of products covering many disciplines: from nanoscale components to large-scale equipment, and from biomedical devices to aerospace structures.
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Weitere Infos & Material


Temperature Fields in Workpieces during Grinding-Hardening with Dry Air and Liquid Nitrogen as the Cooling MediaResearch on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 1: Mechanism StudyResearch on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 2: Factorial StudyEffects of Vibration-Assisted Grinding on Wear Behavior of Vitrified Bond Al2O3 WheelInfluence of Particle Effects on the Material Removal Rate Utilizing Electrokinetic PhenomenonDiamond Tools for the Grinding of Complex Ceramic Implant SurfacesOptimization of Coated SiC Belt Grinding of Alumina Ceramics Development of CBN Internal Grinding Machine for Precision Grinding of the Air-Conditioner Compressor Piston HoleSurface Characteristics and Roughness Prediction of TC4 Titanium Alloy in High Speed GrindingExperimental Research of Grinding Force and Specific Grinding Energy of TC4 Titanium Alloy in High Speed Deep GrindingExperiment Research on the Temperature Field and Thermal Error Distribution of NC Grinding MachineRemote Fault Diagnosis System of Ultrahigh Speed Grinding Based on Multi-Agent Research on the Heat Partition Ratios in Grinding AreaELID Assisted Grinding of Optical Glass with Fine and Coarse Grained Copper-Resin Bonded Diamond WheelsMolecular Dynamics Simulation of Chemo-Mechanical Grinding (CMG) by Controlling Interatomic Potential Parameters to Imitate Chemical ReactionOptimization of Cutting Edge Truncation Depth for Ultrasonically Assisted Grinding to Finish Mirror SurfaceImprovement of Grindactivity by Dressless Wheel Treatment in Dry Grinding of Carbon Prediction of Surface Roughness by 3D-CAD Model in Helical Scan Grinding and Groove GrindingMeasurement of the Tangential Grinding Force Using the Slip of an Induction Motor?Construction of the Measurement SystemInvestigation of the Grinding Wheel Air Boundary Layer FlowThe Effect of Special Structured Electroplated CBN Wheel in Dry Grinding of 100Cr6Wear of a Brazed Diamond Grinding Wheel with Diamond Grits Covered with Brazing Alloy Preparation of Brazed CBN Abrasive Tools Using Composite Fillers of AgCuTi Alloy and TiB2 ParticlesContact Stiffness of Grinding Wheels due to the Difference of Table Feed RateEstimation Method of Grain-Height Distribution Based on the Working Surface Profile of Grinding WheelsQuantification Method of Cutting-Edge Density Considering Grain Distribution and Grinding MechanismEstimation of Grinding Wheel Performance by Dressing Force MeasurementEffect of the Coolant Lubricant Type and Dress Parameters on CBN Grinding Wheels PerformanceVibrations Representation in Grinding Wheels? Virtual Truing and Dressing ModelEstimation of Dressing Effects in Chemical Mechanical Polishing with Sorts of Diamond DressersResearch on Electrical Discharge Truing for Precision Profile Grinding with Cast Iron-Bonded Diamond WheelDevelopment and Application of a Micro-Honing-ToolInvestigation of the Wear of the Pad Conditioner in Chemical Mechanical Polishing Process Dressing Behaviors of PCD Conditioners on CMP Polishing PadsA Study of Thermal-Chemical Polishing for CVD Diamond Thin FilmsA Briefing on the Manufacture of Hip Joint ProsthesesThe Computer-Controlled Chemical Polishing Techniques for Precision Optics Anisotropic Analysis on Processed Surface of KDP Single CrystalsInfluence of Abrasive on Planarization Polishing with the Tiny-Grinding Wheel Cluster Based on the Magnetorheological Effect Experimental Study on Polishing Characteristics of Ultrasonic- Magnetorheological Compound FinishingTheoretical and Experimental Research on the Material Removal Rate in Ultrasonic Aided Lapping of ZTA CeramicEffects of Horizontal Vibration Assistance on Surface Roughness in Magnetic Abrasive FinishingDeep Hole Honing Based on Squeeze Film Damping TechnologyProcessing of WC-Co Cemented Carbide Ball by EDR and RDP Lapping ModesAn Analytical Solution for Parameter Selection for Polishing Spherical Surfaces A Study on a Polishing Process of Cr12 Hardening Steel with the Embedded Combined ToolsStudy on a Magnetic Deburring Method by the Application of the Plane Magnetic Abrasive Machining ProcessStudy on Lapping and Constant-Pressure Grinding of Single-Crystal SiCStudy of Three-Dimensional Polishing Using Magnetic Compound Fluid (MCF) Study on Magnetic Field Distribution in the Container of Magnetic Barrel Finishing MachineFinishing Characteristics in Barrel Finishing of Centrifugal Disc Type on Flow-Through System Study on On-Machine Deburring for Narrow Slits Made by Laser CuttingSimulation of Planarization of Rectangular Glass Plate Using Tool-Path-Control-Type PolishingElectric Field-Assisted Glass Polishing Using Electro-Rheological Gel PadDynamic Friction Polishing Method Utilizing Resistance Heating for Efficient Removal of Electrically Conductive DiamondThe Detailed Performance of MCF Polishing Liquid in Nano-Precision Surface Treatment of Acrylic ResinPolishing of Nickel Cylinder Using a Photocatalyst and Fluorescent Substance Excited by an Ultraviolet RayA Study on Nozzle Wear Modeling in Abrasive Waterjet CuttingNecessary Cutting Energy in Abrasive Waterjet MachiningModeling Material Removal in Fracture Erosion for Brittle Materials by Abrasive WaterjetAbrasive Technology in Ceramic Restorative DentistryThe Microchannel of Microfluidic Chip Fabrication by Micro-Powder BlastingStudy on Micro Blasting of Glass for Micro Channel FormingThe Study on the Abrasion Characteristic of Wafer Surface According to Machining Condition Nanoscratching-Induced Phase Tansformation of Monocrystalline Silicon ? The Depth-of-Cut Effect Determination of Elastic Modulus of Thin Coating Materials Using Nanoindentation and Finite Element AnalysisA Note on the Unloading Behavior of Silicon Subjected to Nanoindentation Deformation and Acoustic Emission during Nanoindentation on Single Crystal MgO (001) PlaneAnalysis of Fixed Abrasive Pads with a Nano-Sized Diamond for Silicon Wafer PolishingLaser Micromachining of Silicon SubstratesChip Size Estimation for Effective Blending Ratio of Slurries in Wire Sawing of Silicon Wafers for Solar CellsEffects of Sodium Carbonate and Ceria Concentration on Chemo-Mechanical Grinding of Single Crystal Si WaferA Novel Single Step Thinning Process for Extremely Thin Si WafersBlasting of Affected Layer of Silicon Surface Sliced by Wire EDMModeling and Analysis of Effects of Machine Tool Stiffness and Cutting Path Density on Infeed Surface Grinding of Silicon WaferProcessing Grinding-Damaged Silicon Wafers by High-Frequency Nano-Second Laser Irradiation Measuring Surface Uniformity in Chemical Mechanical PolishingAbrasive Surfaces Measured by Digital Optical StereopsisThe Effect of Cooling Lubrication Methods on Surface Roughness Measured by the White Light InterferometerFabrication of Aspheric Micro Lens Array by Slow Tool ServoFundamentals of BK7 Glass Removal in Micro/Nano-MachiningThe Experimental Research on Small Hole Machining in Glass Using Diamond Abrasive Core-ToolsFabrication of Carbon Nanotube Probes in Atomic Force MicroscopyA Study of Carbon Nanotubes as Cutting Grains for Nano MachiningStudy on Unique Cutting Phenomena in Micro Endmilling - Mechanism and Possibility to Occur- An Approach for Improvement of Machining Accuracy in Micro End MillingEvaluation of GMR Head Durability against Nanoscale Scratches Using High-Field Transfer Curves Study on Replication of Micro Channel Structures onto Polytetrafluoroethylene (PTFE) Substrate Employing Two-Stage Hot Embossing Effects of Machining Parameters on Surface Roughness in Microturning of OFHC CopperSurface Profile Simulation during Plane Strain Compression by Crystal Plasticity Finite Element MethodAnalysis of Surface Roughness of Low Carbon Steel during Cold Rolling of Thin StripMechanics of Scratch Marks in Cold Rolling of Thin StripAnalysis of Surface Temperature and Thermal Stress Field of Slab Continuous CastingFinite Element Simulation of Mix Driven by Electroosmotic Flow in MicrochannelsModeling and Optimization of Process Parameters in Micro Wire EDM by Genetic AlgorithmStudy on Parametric Influence, Optimization and Modeling in Micro WEDM of Ti AlloyFabrication of Multiple Micro-Grooves by Ultrasonic Machining with a Tool that Laminated Thin Hard-Material and Thin Soft-Material Towards Improving Rock Cutting Tools Using Thermally Stable Diamond CompositesRapid Estimation of Rock Cuttability Using Fracture Toughness and Rock StrengthCutting Edge Preparation for Cemented Carbide Milling ToolsA Study of the Grinding Alumina for the Multi-Point Diamond ToolsEffect of Microstructure on Mechanical Properties and Wear Characteristics of Cemented Tungsten CarbidesSurface Integrity in Electrical Discharge Machining of Ti-6Al-4VEffect of Helical Drill Points on Delamination in Drilling Carbon Fiber Reinforced Plastics (CFRP)Dynamics and Stability of Milling Process Considering the Gyroscopic EffectsResearch of Pulse Inversion Power Supply of ECM and its TechniquesA Preliminary Study of Variable Strength Activation of Coolant for Precision MachiningTest of Focusing and Superposition for Variable Strength Activation of Coolant in Precision MachiningElectrode Design for Oscillating EDMPurification Effect of Micro Bubble CoolantEffects of Combined Ultrasonic Vibration during the Sinking EDM Process for Cemented CarbideStudy on Precision Machine Table Equipped with Constant-Flow Hydrostatic Water BearingsDevelopment and Application of CSD Diamond AbrasivesDevelopments of Industrial Diamond Industry in ChinaDevelopment of New PCD Made Up of Boron Doped Diamond Particles and its Machinability by EDMMicro-Raman Stress Investigation of Polycrystalline Diamond Compact (PDC) Control of the Behavior of Abrasive Grains by the Effect of Electrorheological Fluid Assistance - Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining - Low Cost Wear Monitoring of Bearing Shell in Connecting Rod via I-kaz MethodHigh Temperature Interfacial Reaction between Glass Gobs and Sol-Gel Coated Al2O3 FilmsThe Effects of Shear Stress on the Lubrication Performances of Oil Film of Large-Scale Mill BearingStudy on Mechanical Properties and Size Effect of Si3N4 Using Discrete Element MethodStudy on Path Control Scheme by Laplacian Potential Field and Configuration Space for Vision Guided Micro Manipulation System


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