Buch, Englisch, 164 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 420 g
Buch, Englisch, 164 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 420 g
ISBN: 978-3-0357-1795-2
Verlag: Trans Tech Publications
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Preface
Chapter 1: Advanced Material and Engineering Structural Technology
The Analysis on the Stamping Formability of High Strength Steel
Hardness Evaluation of 88Cu-4Pb-4Sn-4Zn Alloy by Mechanical Alloying with Oxidizing Atmosphere
MALDI Mass Spectrometry Study of Glycated Substrates
Mass Spectrometry-Based Proteomic Approach in Juglans regia
Design and Performance Test of Ozone-Plasma Hybrid Reactor for Phenol Waste
Shrinkage of Alginate Hydrogel Bioinks Potentially Used in 3D Bioprinting Technology
Analysis of Biodegradable Solid-State Filter Using Voltage Peak Analysis
Synthesis and Characterization of Zinc Coated Carica papaya Extracts for Solid-State Application
Evaluation of Novel Strategies for Carbon Nanotube Functionalization by TGA/Chemometrics
Edible Film Coatings to Extend the Shelf-Life of Fresh-Cut Pineapple
Chapter 2: Symposium on Materials Science and Engineering
Adsorption of Mercury(II) Ion in Aqueous Solution by Using Bentonite-Based Monolith
Preparing Modified Activated Carbon from Cassia Fistula Seed with HNO3 for Zinc Removal in Wastewater
Composite Coatings Formed on PEO Pretreated MA8 Magnesium Alloy in Aqueous Suspension of PTFE
Effective Degradation of Cigarette Butts via Treatment with Old Landfill Leachates
A Preliminary Study on Recyclability of Mixed Plastic Wastes Recovered from Urban Collection
Effect of Different Types of PLA on the Properties of PLA/PBAT Blown Films
Photoluminescence of Sol-Gel Synthesized ZnO Nanostructures
Lateral Force Resisting Systems Made of Cold-Formed Steel Material: Proposal of Seismic Design Criteria for 2nd Generation of Eurocode 8
Influence of the Bolt Material Properties on the Ultimate Capacity of End Plate Bolted Joint Subjected to Column Loss
Analysis of Micro Structure and the Resistivity of Cu / Ni Thin Coat as a Low Temperature Sensor Using Electroplating Method Assisted with Magnetic Field outside of the Ion Flow