Functional Materials and Processing Technologies II

Erscheinungsjahr 2018
ISBN: 978-3-0357-1427-2
Verlag: Trans Tech Publications

Buch, Englisch, 156 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 410 g

This special issue presents results of scientific research and engineering decisions in the fields of materials and manufacturing technologies in the construction and modern mechanical engineering.

Autoren/Hrsg.

Kong, Ha-Sung

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde

Inhaltsverzeichnis

Preface
Chapter 1: Materials and Technologies in Civil and Industrial Construction
On the Parallel Implementation of BIM-Technologies in Construction and Operation of Buildings
Polyelectrolytes Efficiency in Grout Property Regulation
Formation of Engineering Thinking in Multilevel Architectural Education
Improvement of Heat-Insulating Properties of Foam Concrete by Means of Mineral Additives
High-Strength Concrete Made of Nonferrous-Metals Industry Waste
Hydrophobic Modifiers for Restoration of Old Wooden Buildings in Western Siberia
Possibilities of New Information Technologies in the System of Urban Planning and Construction
One of Geotechnological Technologies for Ensuring the Stability of the Boiler of the Pit
Use of the Piles of Effective Type in Geotechnical Construction
Ground Ancher Produced by Electric Discharge Technology, as Monolithic Reinforced Concrete Structure
Mathematical Modelling of the Calculation of the Stiffness Characteristics of Composite Materials
Chapter 2: Key Engineering Materials and Processing Technologies
Evaluation of the Thermal Processes and Simulation Methods for Additive Manufacturing Based on the Geometry Voxel Representation
Current Issues of Developing Methodology and Software Solutions Used in Different Phases of Modelling Additive Production Processes
High Temperature Coatings for Oxidation and Erosion Protection of Heat-Resistant Carbonaceous Materials in High-Speed Flows
Contact Melting of Aluminum-Silicon Structures under Conditions of Thermal Shock
Influence of Constant Magnetic Fields on Defect Formation under Conditions of Heat Shock in Surface Layers of Silicon
Preparation of a Semiconductor Film with the Aid of a Superionic
Mathematical Modeling of Thermal Association in a Porous Medium with a Capillary Effect in Anisotropic Composite Materials

Über Autor(innen)

Ed. Ha-Sung Kong