Buch, Englisch, 544 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 1100 g
ISBN: 978-0-87849-364-7
Verlag: Trans Tech Publications
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Preface
I. Grinding Mechanism
Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone
Study on the Subsurface Damage of Single Crystal MgO Substrates
Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer
Comparative Study on the Materials Removal Mechanism of Ceramics and Steels
Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters
Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool
Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding
Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model
II. Grinding Systems and Tools
Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB
Experimental Trial of Fullerene Wheel Fabrication
Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology
Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools
Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste
III. Measurement and Modeling
Error Analysis and Robust Position Measurement for Vertex of a Small Polyhedron
Grinding Burn and Chatter Classification Using Genetic Programming
Control of Nano-Topography on an Axisymmetric Ground Surface
Measurement of High-NA Axisymmetric Aspherical Surface with Continuous Interference Method
Observation of Grinding Wheel Wear Patterns by Means of a 3-Dimensional Digital Measuring Method
Numerical Analysis for Thermal Deformation of Workpiece in Cylindrical Plunge Grinding
Fuzzy Rules for Surface Roughness of Ground Steels
Geometrical Simulation of Surface Finish Improvement in Helical Scan Grinding Method by Means of 3D-CAD Model
IV. Cutting
Planing of Cobalt-Free Tungsten Carbide Using a Diamond Tool -Cutting Temperature and Tool Wear-
Cutting Temperature Measurement in Turning with Actively Driven Rotary Tool
Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools
Machinability Investigation of Reaction-Bonded Silicon Carbide by Single-Point Diamond Turning
High Speed Cutting of Titanium Alloy with PCD Tools
Development of DLC Coated Tool for Cutting of Aluminum Alloy -Influence of Deposition Condition on Cutting Characteristic-
Observations on Orthogonal Cutting Processes - Effect of Friction between Tool and Work Material -
Development of A New Cutting Fluid Supply System for Near Dry Machining Process
V. Field-Assisted Machining
Study on the Surface Quality of Optical Glass in Ultrasonic-Magnetorheological Compound Finishing
Quartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen
Simulation and Experimental Analysis of Electromagnetic Inductor for Magnetic Abrasive Finishing
The Research of NC Magnetic Abrasive Finishing for Mould Parting Surface
VI. New Grinding Processes
Computer Aided Design and Grinding for Helical Drill Points
A New CBN Crystal for Improved Grinding Performance in Vitrified Bonds
Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film
Fundamental Study on the Precision Abrasive Machining Using a Cavitation in Reversing Suction Flow
Researches on Effect of Impact Micro-Damages in Contact Layer on Machinability in Quick-Point Grinding
Study on Abrasive Geometry of Quick-Point Grinding
Model-Based Compensation of Geometry-Errors when Grinding Material Compounds
A New Type of Drill Grinder Based on the Special Universal Joint
Simulation of Dynamic Performance for Hydro-Hybrid Spindle-Bearing System of Superhigh Speed Grinder
Model Based Characterization of the Grinding Wheel Effective Topography
VII. Vibration-Assisted Machining
Fabrication of High-Aspect Ratio Micro Holes on Hard Brittle Materials -Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining-
Grinding of Soft Steel with Assistance of Ultrasonic Vibrations
Ultrasonic Vibration-Assisted Cutting of Titanium Alloy
Effects of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted Grinding
Electrochemical Finishing with an Electrode Vibrated with Biaxial Ultrasonic Transducer
Synchronous Finish Processes Using Grinding and Ultrasonic Electrochemical Finishing on Hole-Wall Surface
Development of a Three-Dimensional Tool Oscillation System for Finishing Metal Molds
VIII. Fluids for Machining
Engineering a Next Generation Water-Based Grinding Fluid
Evaluation of Bearing Grinding Fluids
The Correlation and Spectrum Research on Cylindrical Surface Lapping Machined with Abrasive Jet Finishing Restricted by Grinding Wheel
Application of a Floating Nozzle to Grinding Process Using an Edge of Grinding Wheel
A Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV
Actively Cooled and Activated Coolant for Grinding Brittle Materials
Spatial Distribution of Cooling Mist for Precision Grinding
IX. Truing and Dressing
A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces
The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon
Virtual Truing and Dressing of Grinding Wheel
Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding
X. Abrasive Jet Machining
A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet
Hole Machining of Glass by Micro Abrasive Suspension Jets
Simulation and Analysis of Abrasive Jet Machining with Wheel Restriction in Grinding
Profit Optimization of Abrasive Blasting Systems
Design of Double Nozzle Type Powder Jet Device Optimized for PJD
XI. Non-Conventional Machining
Thermal Deformation of Base Sheet and Local Deformation Around Laser Cutting Edge
Grinding Combination of Electrochemical Smoothing On SKH 51 Surface
Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction
Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation
An Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone Oil
XII. Slicing and Edge Processing
Analysis on the Fracture Failure of Brazed Diamonds in Wire Sawing
Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy
Study on Glass Strength at High Speed Edge Rounding for LCD
XIII. CMP and Semiconductor Processing
The Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding
Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation
Study on Adhesion Removal Model in CMP SiO2 ILD
Study on the CMP Pad Life with its Mechanical Properties
Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad
A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition
Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization
Achieving a Damage-Free Polishing of Mono-Crystalline Silicon
Effect of Polishing Time and Pressure on Polishing Pad Performance
Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives
Scale Effect of Nano-Indentation of Silicon – A Molecular Dynamics Investigation
