Buch, Englisch, 292 Seiten, Format (B × H): 191 mm x 235 mm, Gewicht: 630 g
High Resistivity Si Interposer Technology
Buch, Englisch, 292 Seiten, Format (B × H): 191 mm x 235 mm, Gewicht: 630 g
ISBN: 978-0-323-99602-0
Verlag: William Andrew Publishing
A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.
Zielgruppe
<p>Engineers in microelectronics such as advanced package technology for 5G RF modules; graduate students working on microelectronics.</p>
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
1. Introduction to HR-Si Interposer Technology 2. Design, process and electrical verification of HR-Si interposer 3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer 4. HR-Si TSV integrated inductor 5. Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer 6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel 7. Patch Antenna in Stacked HR-Si interposers 8. Through Glass Via Technology 9. Conclusion and outlook