Ultra Clean Processing of Semiconductor Surfaces XV

Erscheinungsjahr 2021
ISBN: 978-3-0357-1801-0
Verlag: Trans Tech Publications

Buch, Englisch, 340 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 710 g

This proceedings volume describes the recent progress in the field of ultra-clean surfaces and surface cleaning and preparation for the production of micro- and nanoelectronic integrated circuits and related subjects. This involves a wide variety of surfaces of mixed composition and with nano-topography with an aspect ratio of lateral dimension/vertical dimension on the order of 1/10. The goal of the processes is to obtain nano precise etching and cleaning, resulting in ultra-clean surfaces with very few residues or defects. This comprises different surface and cleaning steps throughout the entire device manufacturing process.

Autoren/Hrsg.

Mertens, Paul W.

Wostyn, Kurt

Meuris, Marc

Heyns, Marc

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik

Inhaltsverzeichnis

Preface
Chapter 1: Contamination and Contamination Control
Surface Cleaning Challenges for Organic Light Emitting Diodes
Characterization and Removal of Metallic Contamination in H2O and H2O2 Using Single Particle Inductively Coupled Plasma Mass Spectrometry
Direct Analysis of Ultra Trace Metallic Particles in NH3 and HCl Gases by Gas Exchange Device (GED)-ICP-MS
Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol
Cl-Containing Microplastics from the Environment
Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines
Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow
Chapter 2: FEOL: Surface Chemistry and Etching of Group IV Semiconductors
Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe
Wet Chemical Cleaning of Organosilane Monolayers
Reaction Kinetics of Poly-Si Etching in TMAH Solution
Surface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 Solutions
Si1-XGeX Selective Etchant for Gate-All-Around Transistors
Chapter 3: FEOL: Surface Chemistry and Etching of III-V Compound Semiconductors
GaN MOS Structures with Low Interface Trap Density
Analysis of Surface Reaction for Group III-V Compound Semiconductors in Functional Water
Effect of Surface Oxidation on the Material Loss of InGaAs in Acidic Solutions
Characterization of Wet Chemical Atomic Layer Etching of InGaAs
Chapter 4: FEOL: Etch Dielectric Films and Removal of Masking Films
Highly Selective Etching between Different Oxide Films by Vapor Phase Cleaning
Silicon Corrosion during Selective Silicon Nitride Etch with Hot Diluted Hydrofluoric Acid
Kinetic Study on the Si3N4 Etching in Superheated Water
Challenges and Solutions of Replacement Metal Gate Patterning to Enable Gate-all-Around Device Scaling
Removal of SOC Hard Mask for Patterning of Work Function Metal by Thermally Activated Ozone Gas
High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System
Chapter 5: Wet Processing in Narrow Spaces and Pattern Collapse
Polydimethylsiloxane Micro-Channels Application for the Study of Dynamic Wetting of Nano-Etched Silicon Surfaces Based on Acoustic Characterization Method
Characterization of Wetting of Deep Silica Nanoholes by Aqueous Solutions Using ATR-FTIR
Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces
Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND
New Test Structure Development for Pattern Collapse Evaluations
Breakthrough of Sublimation Drying by Liquid Phase Deposition
Chapter 6: Fundamentals of Megasonic Agitation
Estimation of the Generation Rate of H· Radicals in a Megasonic Field Using an Electrochemical Technique
Visualization of Acoustic Waves and Cavitation in Ultrasonic Water Flow
Simulation of Rayleigh Bubble Growth near a No-Slip Rigid Wall
Effect of Surfactant in Gas Dissolved Cleaning Solutions on Acoustic Bubble Dynamics
Interaction between Free-Surface Oscillation and Bubble Translation in a Megasonic Cleaning Bath
Chapter 7: Particle Removal
Study on Uniform Deposition on 300 mm Silicon Wafer with Sub-100 nm Sized Particles for Cleaning Application
Ultrafine Particle Removal in the Wafer Cleaning Process Using an Aqueous Solution with a High Concentration of Dissolved O3 and HF
Particle Removal in Ultrasonic Water Flow Cleaning Role of Cavitation Bubbles as Cleaning Agents
Scalable Particle Removal for sub-5 nm Nodes
The Effect of Thermal Aging on Nano-Particle Removal
Chapter 8: Post-CMP Cleaning
Contact Vs. Non-Contact Cleaning: Correlating Interfacial Reaction Mechanisms to Processing Methodologies for Enhanced FEOL/BEOL Post-CMP Cleaning
Effect of Viscosity on Ceria Abrasive Removal in the Buffing CMP Process
Nodule Deformation of PVA Roller Brushes on a Rotating Plate: Optimum Cleaning for Nanosized Particles due to Liquid Absorption and Desorption of Sponge Deformation
Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process
Tribological Characterization of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning Solution Using a Novel Post-CMP PVA Brush Scrubber
Effect of Dissolved Oxygen on Removal of Benzotriazole from Co during a Post-Co CMP Cleaning
Chapter 9: BEOL Cleaning
Removal of Post Etch Residue on BEOL Low-K with Nanolift
Copper Catalysis Effect Investigation for TiW Etch Process on Patterned Wafers
Selective Nickel Platinum Removal without Titanium Nitride Metal Gate Corrosion
Roughness and Uniformity Control during Wet Etching of Molybdenum
Effect of Surface Chemistry on Ruthenium Wet Etching
Selective Ru or Co Etch for 3nm Applications
Remote Plasma Etching of Backend Semiconductor Materials for Reliable Packaging