Buch, Englisch, 183 Seiten, PB, Format (B × H): 148 mm x 210 mm, Gewicht: 275 g
Buch, Englisch, 183 Seiten, PB, Format (B × H): 148 mm x 210 mm, Gewicht: 275 g
Reihe: Berichte aus der Elektrotechnik
ISBN: 978-3-8440-3360-1
Verlag: Shaker
This thesis studies the application of physics-based via models for an efficient modeling of large via arrays in multilayer PCBs. Three main aspects are addressed: the study and improvement of the modeling accuracy, the study and improvement of the model efficiency, and the application of the model in a systematic evaluation of via array design alternatives for high speed links.
With regard to the modeling accuracy, the application of an improved local field model is identified as a suitable way to improve the model accuracy for the simulation of via arrays, especially at frequencies above 20 GHz. With the improved model, an accurate simulation of via arrays with a pitch of 60 mil or larger becomes possible in the frequency range up to 50 GHz. Improvements with regard to the model efficiency lead to a reduction of calculation times which allows to carry out fast design explorations for smaller via arrays on a standard PC. Finally, an approach for a systematic design evaluation is presented which integrates the advantages of the efficient physics-based via model in a larger concept. With the approach, a quantitative comparison of design alternatives becomes possible that takes into account the impact of design changes on both signal integrity and energy efficiency for the complete system.
