Puttlitz / Stalter Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Erscheinungsjahr 2004
ISBN: 978-0-203-02148-4
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 1048 Seiten

Reihe: Dekker Mechanical Engineering

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Zielgruppe

Scientists, engineers, managers, and students involved with research, development, design, assembly, manufacture, applications, quality, reliability, and equipment testing of microelectronics

Autoren/Hrsg.

Puttlitz, Karl J.

Stalter, Kathleen A.

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Metallurgie
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikrowellentechnik

Inhaltsverzeichnis

Background and Driving Forces. Materials and Manufacturing Considerations. Reliability Considerations.