Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

1. Auflage 2004
ISBN: 978-0-8247-4870-8
Verlag: Taylor & Francis Inc

Buch, Englisch, 1044 Seiten, Format (B × H): 180 mm x 266 mm, Gewicht: 1946 g

Reihe: Mechanical Engineering

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Zielgruppe

Professional

Autoren/Hrsg.

Puttlitz, Karl J.

Stalter, Kathleen A.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren

Inhaltsverzeichnis

Background and Driving Forces. Materials and Manufacturing Considerations. Reliability Considerations.

Über Autor(innen)

Karl J. Puttlitz, Kathleen A. Stalter